Abstract: A flexible die case system for forming a variety of face plates used in telecommunications equipment without having to replace the mold base is provided. The system includes a main insert for forming a first portion of the face plate and a sub-insert for forming a second portion of the face plate. The second portion includes the minor variations that might be required to accommodate minor variations in face plate requirements. For example, the second portion can be used to change the number, size and location of apertures used for light emitting diodes, as well as the number, size and location of ports used to make connections to the electronics carried by or associated with the face plate.