Abstract: A semiconductor package extractor is provided that extracts a semiconductor package from a socket on a circuit board. The extractor has an outer base and an inner base which are attached via a bolt. Turning the bolt raises or lowers the inner base. The inner base has an inner frame with multiple levers that swing freely inward and outward attached to the inner frame. The levers swing outward to surround the semiconductor package as the inner base is lowered onto the inner base and underlying circuit board. The levers swing inward to securely grip the semiconductor package as the outer base is lowered onto the circuit board. As the bolt is turned, the inner base, gripping the semiconductor package, is raised, removing the semiconductor package from the circuit board.