Patents by Inventor Daniel C. Webster, deceased

Daniel C. Webster, deceased has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for establishing a solder bond to a solder ball grid array
    Patent number: 5902495
    Abstract: Apparatus and method for establishing a solder bond between a solder ball grid array and a circuit mounted on a substrate includes a bonding tool having a bonding tip for applying heat to the site of one or more of the solder balls in the solder ball grid array, a transducer for measuring displacement of the bonding tip during the bonding operation, and a signal generator responsive to the transducer for providing a signal indicative of tip displacement. The signal generated by the signal generator may be fed back to the bonding tool to optimize bonding parameters.
    Type: Grant
    Filed: October 22, 1996
    Date of Patent: May 11, 1999
    Assignee: International Business Machines Corporation
    Inventors: Edward J. Burke, Donald Wesley Henderson, Lawrence Philip Lehman, Daniel C. Webster, deceased