Abstract: A method of calibrating a test platform for microwave packages is provided. According to the invention, the conventional Thru, Reflect and Line standard patterns are replaced by microwave standard packages fulfilling similar functions, the test platform being adapted accordingly. The use of standard packages makes it possible to retain the same electrical interface between each of the packages and the test platform. The invention also relates to a method of determining an electrical length LC of an etched line linking two microwave feeds of a microwave standard package. The standard package may be connected to the test platform. According to the invention, various electrical lengths of the test platform are measured so as to be able to deduce therefrom the electrical length LC of the etched line of the standard package. The invention exhibits the advantage of obtaining the electrical length LC by measurement rather than by modeling.

Abstract: The invention relates to a microwave package delimiting an interior volume, comprising a Faraday cage formed by a conducting surface surrounding the interior volume, a connection point placed outside the Faraday cage, the connection point being intended to be linked electrically to an exterior circuit, an input-output passing through the Faraday cage and linked electrically to the connection point, a base forming a face of the package, the exterior surface of the base forming a mounting surface intended to be applied to the exterior circuit, the connection point being placed on the mounting surface, so that the connection point is placed between the Faraday cage and the exterior circuit when the package is mounted on the exterior circuit. The invention applies to microwave packages used in the realms of avionics, telecommunications, space.

Abstract: The invention relates to a microwave package delimiting an interior volume, comprising: a Faraday cage formed by a conducting surface surrounding the interior volume, a connection point placed outside the Faraday cage, the connection point being intended to be linked electrically to an exterior circuit, an input-output passing through the Faraday cage and linked electrically to the connection point, a base forming a face of the package, the exterior surface of the base forming a mounting surface intended to be applied to the exterior circuit, the connection point being placed on the mounting surface, so that the connection point is placed between the Faraday cage and the exterior circuit when the package is mounted on the exterior circuit. The invention applies to microwave packages used in the realms of avionics, telecommunications, space.