Publication number: 20070026769
Abstract: The present invention provides a method for planarizing/polishing a surface, a method for manufacturing an integrated circuit and a chemical mechanical polishing apparatus. The method for planarizing/polishing a surface, among other elements, includes providing a chemical mechanical polishing apparatus (200, 300, 400) having a polishing platen (210, 310, 410), a carrier head (220, 320, 420) positioned over the polishing platen (210, 310, 410), and a slurry delivery source (230, 330, 430) positioned over and off center the polishing platen (210, 310, 410), and rotating the polishing platen (210, 310, 410) in a direction (Rp2, Rp3, Rp4) such that slurry exiting the slurry delivery source (230, 330, 430) and contacting the polishing platen (210, 310, 410) must rotate an angle (?2, ?3, ?4) less than about 220 degrees before contacting a polishable surface maintained by the carrier head (220, 320, 420).
Type:
Application
Filed:
July 28, 2005
Publication date:
February 1, 2007
Applicant:
Texas Instruments, Incorporated
Inventors:
Eugene Davis, Kyle Hunt, Daniel Caldwell