Patents by Inventor Daniel Callahan

Daniel Callahan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210329853
    Abstract: A process of making a mycological biopolymer of a mycomaterial filter comprising the steps of filling a scaffold with a nutritive substrate and a fungus, placing an encasement on the scaffold to seal the scaffold, said encasement having only one outlet therein open to fresh air and defining a vacant space, incubation of the sealed scaffold at high temperatures and carbon dioxide concentrations to induce biopolymer growth into the vacant space wherein the mycological biopolymer environmental conditions comprise an environmental temperature from 55° F. to 95° F. and carbon dioxide constitutes from 2% to 8% of the environment within the vacant space, and thereafter drying the produced mycological biopolymer.
    Type: Application
    Filed: April 28, 2021
    Publication date: October 28, 2021
    Inventors: Philip Ross, Matthew L. Scullin, Rachel Linzer, Ritu Bansal Mutalik, Nicholas Romano, Daniel Callahan
  • Publication number: 20200173076
    Abstract: Provided herein are electrospun or electroblown non-woven fiber membranes, methods of making such membranes and lateral flow diagnostic devices comprising such membranes.
    Type: Application
    Filed: July 20, 2018
    Publication date: June 4, 2020
    Inventors: William Cataldo, Inga Elkina, Kamran Beyzavi, Thomas Fitzgerald, Dennis Aquino, Daniel Callahan, Michael Mansfield, Mikhail Kozlov, Gabriel Tkacik, Murugan Rajendiran, Ramesh Babu Padamati
  • Publication number: 20080055870
    Abstract: A force distributor is configured for disposition between a printed circuit board and a stiffening plate, which is spaced from the printed circuit board. The force distributor is configured to distribute a compressive force between the printed circuit board, an interposer and a land grid array module carried on a side of the printed circuit board opposite the stiffening plate. The force distributor comprises a spring element comprising a first portion and a second portion with the first portion extending radially outward from the second portion. The spring element is configured for placement so that the first portion is secured to the stiffening plate and the second portion is biased in unsecured, pressing contact against the printed circuit board.
    Type: Application
    Filed: October 29, 2007
    Publication date: March 6, 2008
    Inventors: Daniel Callahan, Raymond Iannuzzelli, S. Cromwell, James Hensley, Zoila Vega-Marchena
  • Publication number: 20050007748
    Abstract: A force distributor is configured for disposition between a printed circuit board and a stiffening plate, which is spaced from the printed circuit board. The force distributor is configured to distribute a compressive force between the printed circuit board, an interposer and a land grid array module carried on a side of the printed circuit board opposite the stiffening plate. The force distributor comprises a spring element comprising a first portion and a second portion with the first portion extending radially outward from the second portion. The spring element is configured for placement so that the first portion is secured to the stiffening plate and the second portion is biased in unsecured, pressing contact against the printed circuit board.
    Type: Application
    Filed: July 8, 2003
    Publication date: January 13, 2005
    Inventors: Daniel Callahan, Raymond Iannuzzelli, S. Cromwell, James Hensley, Zoila Vega-Marchena