Abstract: Laser processing machines, such as laser cutting machine, including a work table receiving workpiece, and work arm with a laser cutting head. Laser cutting head includes nozzle receiving device and nozzle. Via nozzle laser beam may be directed onto work piece. Machine includes main drives moving work arm and/or the laser cutting head on X-Y-Z axes to process work piece, as well as an alignment unit to adjust laser beam. An adjusting station includes receiving unit fixing nozzle and/or the nozzle receiving device during centering of nozzle. The alignment unit has head element in laser cutting head. Head element receives nozzle and/or the nozzle receiving device and is slidable in X-Y directions, via the main drives. Head element may be fixed in a selected position, within the laser cutting head, via clamping device releasable during nozzle centering at adjusting station.

Abstract: Laser processing machines, such as laser cutting machine, including a work table receiving workpiece, and work arm with a laser cutting head. Laser cutting head includes nozzle receiving device and nozzle. Via nozzle laser beam may be directed onto work piece. Machine includes main drives moving work arm and/or the laser cutting head on X-Y-Z axes to process work piece, as well as an alignment unit to adjust laser beam. An adjusting station includes receiving unit fixing nozzle and/or the nozzle receiving device during centering of nozzle. The alignment unit has head element in laser cutting head. Head element receives nozzle and/or the nozzle receiving device and is slidable in X-Y directions, via the main drives. Head element may be fixed in a selected position, within the laser cutting head, via clamping device releasable during nozzle centering at adjusting station.

Abstract: Laser processing machines, such as laser cutting machine (LM), including a work table receiving workpiece (W), and work arm (1) with a laser cutting head (2). Laser cutting head (2) includes nozzle receiving device (7) and nozzle (D). Via nozzle (D) laser beam (11) may be directed onto work piece (W). Machine (LM) includes main drives moving work arm (1) and/or the laser cutting head (2) on X-Y-Z axes to process work piece (W), as well as an alignment unit to adjust laser beam (11). An adjusting station (3) includes receiving unit (31) fixing nozzle (D) and/or the nozzle receiving device (7) during centering of nozzle (D). The alignment unit has head element (5B) in laser cutting head (2). Head element (5B) receives nozzle (D) and/or the nozzle receiving device (7) and is slidable in X-Y directions, via the main drives. Head element (5B) may be fixed in a selected position, within the laser cutting head (2), via clamping device (12) releasable during nozzle centering at adjusting station (3).

Abstract: Laser processing machines (LM), in particular laser cutting machines with long-wave laser radiation (in particular CO2 laser), including at least one laser processing head (1), having interior (2) and nozzle (3) with nozzle orifice (4) for allowing a primary beam (5), in particular a focused laser working beam, to pass through and onto a work piece (6) and to align a gas current enveloping the beam, and an alignment device (15) with several sensors (13) for centering the primary beam (5), in particular a focused laser working beam, and the nozzle orifice (4) relative to each other. At least one conversion unit (9), in particular a conversion edge, is provided in the area of the nozzle orifice (4) for converting the primary beam (5) contacting it or impacting on it into one or more secondary electromagnetic heat beams (10) along at least one propagation direction (10A) in direction of the sensors (13).

Abstract: Laser processing machines and methods for adjusting focused laser beams. Laser processing heads have nozzle with openings admitting primary laser beam. An orientation device is included, as well as at least one sensor to mutually center primary beam and opening of nozzle. A first beam handling unit is arranged near the nozzle opening and may convert primary beam into a secondary wide-band heat beam, and then may emit this secondary beam towards a sensor; or may reflect/scatter at least a portion of the primary beam towards sensor. The sensor detecting the converted secondary beam is arranged within the laser processing head. In an adjustment process, a primary beam may be converted into a wide-band heat radiation as secondary radiation at the beam handling unit, and emitted and/or diverted into a scattered/reflex beam towards the sensor.

Abstract: Laser processing machines (LM), in particular laser cutting machines with long-wave laser radiation (in particular CO2 laser), including at least one laser processing head (1), having interior (2) and nozzle (3) with nozzle orifice (4) for allowing a primary beam (5), in particular a focused laser working beam, to pass through and onto a work piece (6) and to align a gas current enveloping the beam, and an alignment device (15) with several sensors (13) for centering the primary beam (5), in particular a focused laser working beam, and the nozzle orifice (4) relative to each other. At least one conversion unit (9), in particular a conversion edge, is provided in the area of the nozzle orifice (4) for converting the primary beam (5) contacting it or impacting on it into one or more secondary electromagnetic heat beams (10) along at least one propagation direction (10A) in direction of the sensors (13).

Abstract: Laser processing machines and methods for adjusting focused laser beams. Laser processing heads have nozzle with openings admitting primary laser beam. An orientation device is included, as well as at least one sensor to mutually center primary beam and opening of nozzle. A first beam handling unit is arranged near the nozzle opening and may convert primary beam into a secondary wide-band heat beam, and then may emit this secondary beam towards a sensor; or may reflect/scatter at least a portion of the primary beam towards sensor. The sensor detecting the converted secondary beam is arranged within the laser processing head. In an adjustment process, a primary beam may be converted into a wide-band heat radiation as secondary radiation at the beam handling unit, and emitted and/or diverted into a scattered/reflex beam towards the sensor.

Abstract: Laser processing machines, such as laser cutting machine (LM), including a work table receiving workpiece (W), and work arm (1) with a laser cutting head (2). Laser cutting head (2) includes nozzle receiving device (7) and nozzle (D). Via nozzle (D) laser beam (11) may be directed onto work piece (W). Machine (LM) includes main drives moving work arm (1) and/or the laser cutting head (2) on X-Y-Z axes to process work piece (W), as well as an alignment unit to adjust laser beam (11). An adjusting station (3) includes receiving unit (31) fixing nozzle (D) and/or the nozzle receiving device (7) during centering of nozzle (D). The alignment unit has head element (5B) in laser cutting head (2). Head element (5B) receives nozzle (D) and/or the nozzle receiving device (7) and is slidable in X-Y directions, via the main drives. Head element (5B) may be fixed in a selected position, within the laser cutting head (2), via clamping device (12) releasable during nozzle centering at adjusting station (3).