Abstract: A method of manufacturing a semiconductor device is provided including forming raised source and drain regions on a semiconductor layer, forming a first insulating layer over the semiconductor layer, forming a first contact to one of the source and drain regions in the first insulating layer, forming a second insulating layer over the first contact, forming a trench in the second insulating layer to expose the first contact, removing a portion of the first contact below the trench, thereby forming a recessed surface of the first contact, removing a portion of the first insulating layer, thereby forming a recess in the trench and exposing a portion of a sidewall of the first contact below the recessed surface of the first contact, and filling the trench and the recess formed in the trench with a contact material to form a second contact in contact with the first contact.