Patents by Inventor Daniel Chavez-Clemente

Daniel Chavez-Clemente has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stretching retention plate for electronic assemblies
    Patent number: 10825714
    Abstract: A substrate retention plate system for holding a substrate for processing in an electronic device manufacturing process is described. The retention plate system includes a top plate and a bottom plate to sandwich a flexible substrate. Additionally, the top plate includes a number of cams to stretch the flexible substrate across the bottom plate.
    Type: Grant
    Filed: April 2, 2016
    Date of Patent: November 3, 2020
    Assignee: INTEL CORPORATION
    Inventors: Daniel Chavez-Clemente, Joshua D. Heppner, Naida Duranovic
  • Method of assembling an electronic component using a probe having a fluid thereon
    Patent number: 10278318
    Abstract: A method of assembly comprising providing an assembly probe, the assembly probe having an end coupling face; providing a droplet of fluid on the end coupling face of the assembly probe; coupling an electronic component to the end coupling face of the assembly probe with the fluid droplet, the electronic component having a peripheral dimension equal to or less than 2 mm in each of length, width and height; placing the electronic component on a substrate with the assembly probe; decoupling the electronic component from the end coupling face of the assembly probe; and assembling the electronic component to the substrate.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: April 30, 2019
    Assignee: Intel Corporation
    Inventors: Kyle Yazzie, Pramod Malatkar, Xiao Lu, Daniel Chavez-Clemente
  • ASSEMBLY PROBE UTLIZING A FLUID TO ASSEMBLE COMPONENTS AND SYSTEMS AND METHODS OF USE THEREOF
    Publication number: 20170181339
    Abstract: A method of assembly comprising providing an assembly probe, the assembly probe having an end coupling face; providing a droplet of fluid on the end coupling face of the assembly probe; coupling an electronic component to the end coupling face of the assembly probe with the fluid droplet, the electronic component having a peripheral dimension equal to or less than 2 mm in each of length, width and height; placing the electronic component on a substrate with the assembly probe; decoupling the electronic component from the end coupling face of the assembly probe; and assembling the electronic component to the substrate.
    Type: Application
    Filed: December 18, 2015
    Publication date: June 22, 2017
    Applicant: Intel Corporation
    Inventors: Kyle Yazzie, Pramod Malatkar, Xiao Lu, Daniel Chavez-Clemente