Abstract: A system and method for token-based transactions to facilitate non-cash payments without using personally identifiable information data is disclosed. The system generally includes at least one computer processor and a module, which when executed by the at least one computer processor, causes the computer processor to exchange data representative of a request for identification with a computing device of a Payer Entity. The computer processor generates a signed Digital Debt Obligation, including purchase metadata comprising currency and at least one preferred payment provider, and sends the signed digital debt to the computing device of the Payer Entity. The computer processor receives data representing an approved Digital Debt Obligation from the computing device of the Payer Entity and verifies the approved Digital Debt Obligation. The computer processor sends data representative of the approved Digital Debt Obligation to a Payment Processor and queries the Payment Processor for supported payment methods.

Abstract: Mobile platforms and methods may provide for an integrated circuit such as a system on chip (SoC), a first heat spreader thermally coupled to the integrated circuit and a phase change material configuration thermally coupled to the first heat spreader. The integrated circuit may include logic to operate the integrated circuit in a performance burst mode according to a duty cycle, wherein the performance burst mode causes a phase change material to enter a liquid state within a graphite matrix of the phase change material configuration.

Abstract: A system and method for token-based transactions to facilitate non-cash payments without using personally identifiable information data is disclosed. The system generally includes at least one computer processor and a module, which when executed by the at least one computer processor, causes the computer processor to exchange data representative of a request for identification with a computing device of a Payer Entity. The computer processor generates a signed Digital Debt Obligation, including purchase metadata comprising currency and at least one preferred payment provider, and sends the signed digital debt to the computing device of the Payer Entity. The computer processor receives data representing an approved Digital Debt Obligation from the computing device of the Payer Entity and verifies the approved Digital Debt Obligation. The computer processor sends data representative of the approved Digital Debt Obligation to a Payment Processor and queries the Payment Processor for supported payment methods.

Abstract: Mobile platforms and methods may provide for an integrated circuit such as a system on chip (SoC), a first heat spreader thermally coupled to the integrated circuit and a phase change material configuration thermally coupled to the first heat spreader. The integrated circuit may include logic to operate the integrated circuit in a performance burst mode according to a duty cycle, wherein the performance burst mode causes a phase change material to enter a liquid state within a graphite matrix of the phase change material configuration.