Patents by Inventor Daniel D. Gonsalves

Daniel D. Gonsalves has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10805707
    Abstract: Systems and methods are directed to a headphone having a headphone cap and a headphone housing. The headphone cap is mechanically coupled to a printed circuit board (PCB) which has a first electrical connector and a second electrical connector. The headphone housing is configured to be mechanically coupled with the headphone cap, and comprises a battery having a third electrical connector and a fourth electrical connector. The third electrical connector is configured to form a first electrical connection with the first electrical connector as a result of the headphone housing being mechanically coupled with the headphone cap. The fourth electrical connector is configured to form a second electrical connection with the second electrical connector as a result of the headphone housing being mechanically coupled with the headphone cap. In mechanically coupling the headphone housing to the headphone cap, the battery is configured to be horizontally adjacent to the PCB.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: October 13, 2020
    Assignee: BOSE CORPORATION
    Inventors: Richard Arthur Grebe, Daniel D. Gonsalves, Daniel H. Sargent
  • Publication number: 20200221209
    Abstract: Systems and methods are directed to a headphone having a headphone cap and a headphone housing. The headphone cap is mechanically coupled to a printed circuit board (PCB) which has a first electrical connector and a second electrical connector. The headphone housing is configured to be mechanically coupled with the headphone cap, and comprises a battery having a third electrical connector and a fourth electrical connector. The third electrical connector is configured to form a first electrical connection with the first electrical connector as a result of the headphone housing being mechanically coupled with the headphone cap. The fourth electrical connector is configured to form a second electrical connection with the second electrical connector as a result of the headphone housing being mechanically coupled with the headphone cap. In mechanically coupling the headphone housing to the headphone cap, the battery is configured to be horizontally adjacent to the PCB.
    Type: Application
    Filed: January 4, 2019
    Publication date: July 9, 2020
    Inventors: Richard Arthur Grebe, Daniel D. Gonsalves, Daniel H. Sargent
  • Publication number: 20200043677
    Abstract: A structure for interfacing a plunger that is exposed outside of a housing and is constructed and arranged to be pushed in relative to the housing so as to operate a switch that is located inside of the housing. The structure has an elastic portion that is constructed and arranged to interface with the plunger so as to maintain the plunger in the housing and a stiff portion that is coupled to the elastic portion and is constructed and arranged to interface with the housing so as to capture the structure in the housing.
    Type: Application
    Filed: July 31, 2018
    Publication date: February 6, 2020
    Inventors: Daniel D. Gonsalves, Seth Mann, Allen T. Graff, Edgardo Alicea
  • Publication number: 20150139458
    Abstract: A device for coupling to a connector on an ear cup of a headset includes a mating connector corresponding to the connector of the headset. The mating connector includes a crossover conductor coupled to a first and a second terminal within the mating connector, a position sensor for determining a position of the device, and a data connection outputting data from the position sensor. The position data is usable to adjust three-dimensional audio signals to account for the direction the user is looking.
    Type: Application
    Filed: December 4, 2014
    Publication date: May 21, 2015
    Applicant: Bose Corporation
    Inventors: Matthew Neil Ruwe, Daniel D. Gonsalves
  • Patent number: 8929573
    Abstract: A device for coupling to a connector on an ear cup of a headset includes a mating connector corresponding to the connector of the headset. The mating connector includes a crossover conductor coupled to a first and a second terminal within the mating connector. One or more accessory circuits is provided by the device, including a lamp configured to direct light onto a surface external to the device or a position detection circuit usable to adjust three-dimensional audio signals to account for the direction the user is looking.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: January 6, 2015
    Assignee: Bose Corporation
    Inventors: Matthew Neil Ruwe, Daniel D. Gonsalves
  • Publication number: 20140079257
    Abstract: A device for coupling to a connector on an ear cup of a headset includes a mating connector corresponding to the connector of the headset. The mating connector includes a crossover conductor coupled to a first and a second terminal within the mating connector. One or more accessory circuits is provided by the device, including a lamp configured to direct light onto a surface external to the device or a position detection circuit usable to adjust three-dimensional audio signals to account for the direction the user is looking.
    Type: Application
    Filed: September 14, 2012
    Publication date: March 20, 2014
    Inventors: Matthew Neil Ruwe, Daniel D. Gonsalves
  • Patent number: 7204701
    Abstract: A bolster plate apparatus, used to secure a semiconductor device intermediate a printed circuit board and a heat sink apparatus, includes either an indentation or an open aperture into which a radio frequency absorptive material may be disposed. The absorptive material may be a ferrite material specifically selected to absorb frequencies in the range of the second to fourth harmonic of the processor clock signal frequency. The type of the ferrite material implanted in the bolster plate is selected to maximize the absorption of radio frequency energy, particularly that emitted at the pad vias on the underside of the printed circuit board, without affecting the signal integrity of the other pad connections. The shape of the cutout or aperture is also defined by the arrangement of RF emitting pads on the underside of the printed circuit board.
    Type: Grant
    Filed: March 8, 2004
    Date of Patent: April 17, 2007
    Assignee: Sun Microsystems, Inc.
    Inventors: Wigneswaran W. Balasingham, Istvan Novak, Robert S. Moffett, Daniel D. Gonsalves
  • Publication number: 20030027445
    Abstract: A protective cover for preventing damage and contamination to the pins within an electrical pin connector on a circuit board includes a semi-rigid housing defining an interior cavity. The housing is removably securable over the pin connector through an attachment mechanism which frictionally engages features on the pin connector and/or circuit board. In one embodiment, the housing includes one or more guide features to facilitate aligning the pin connector with the interior cavity of the housing. Multiple pin connectors may be accommodated within the interior cavity of the housing. Alternatively, the interior cavity may be partitioned into separate cavities, each of which may accommodate multiple pin connectors. A fin or rib may project from a surface of the housing to facilitate attachment or removal of the housing either manually or with a machine.
    Type: Application
    Filed: August 1, 2001
    Publication date: February 6, 2003
    Inventors: James M. Carney, Robert S. Antonuccio, Timothy M. Holland, Daniel D. Gonsalves, Paul V. Moruzzi
  • Publication number: 20020139759
    Abstract: A method and apparatus for retaining a component within a base structure is provided. The component retention mechanism, in accordance with one example embodiment of the present invention, has a bolt receiver mounted to a base structure into which the component to be installed mounts. The base structure can be, e.g., a computer hardware rack structure. A spring casing mounts to the component to be installed. A spring having a first end and a second end mounts within the spring casing. At least one bolt extends from one of the first and second ends of the spring, such that the bolt engages with the bolt receiver to retain the component in the base structure as desired.
    Type: Application
    Filed: March 27, 2001
    Publication date: October 3, 2002
    Applicant: Sun Microsystems, Inc.
    Inventors: James M. Carney, Daniel D. Gonsalves, Robert S. Antonuccio, Timothy M. Holland
  • Patent number: 6392893
    Abstract: A method and apparatus relating to a support bracket (18) enabling hot-swapping of component trays (16) in component racks (10) is disclosed. A bracket (18) is provided for removably mounting a tray (16) in a component rack (10). The bracket (18) has two guide channels (20) extending substantially from a front end of the bracket (18) through to a back end. The guide channel (20) is adapted for sliding engagement with the component carrying tray (16). In addition, there is at least one stop guide (30) that projects from each of the front and back ends of the bracket (18). This stop guide (30) aids in positioning the bracket (18) during installation. On a backside of the bracket (18), there is a detent (32) that projects outward. The detent (32) serves as an aid in positioning and releasably holding the bracket (18) in place during installation.
    Type: Grant
    Filed: November 8, 2000
    Date of Patent: May 21, 2002
    Assignee: Sun Microsystems, Inc.
    Inventors: James M. Carney, Robert S. Antonuccio, Timothy M. Holland, Daniel D. Gonsalves, Joseph J. Montagna
  • Patent number: 6377459
    Abstract: A cooling assembly for cooling chips is disclosed. The assembly includes a heat sink, a plate member, and a heat pipe. The heat sink is attachable to a first chip. The plate member is attachable to a second chip. The heat pipe is arranged between the heat sink and plate member such that one end of the heat pipe attaches to the heat sink and the other end of the heat pipe attaches to the plate member. A system for cooling chips and method for dissipating heat generated by chips are also disclosed.
    Type: Grant
    Filed: August 4, 2000
    Date of Patent: April 23, 2002
    Assignee: Sun Microsystems, Inc.
    Inventors: Daniel D. Gonsalves, Robert S. Antonuccio
  • Patent number: 6239592
    Abstract: A test fixture which holds multiple circuit boards in an edge-to-edge configuration for testing includes a sliding interconnect mechanism which is located between the circuit boards under test. The interconnect mechanism includes an interconnect board on which are mounted pairs of inter-wired frame connectors which mate with the connectors on each of the printed circuit boards to be tested and electrically interconnect the boards. The interconnect mechanism includes guide pins on which the interconnect mechanism slides to accurately align the frame and board connectors and an actuating mechanism to move the interconnect mechanism into position to securely mate the aligned connectors. The actuating mechanism can also be reversed to unmate the connectors and release the boards under test after the tests are completed.
    Type: Grant
    Filed: June 2, 1999
    Date of Patent: May 29, 2001
    Assignee: Sun Microsystems, Inc.
    Inventors: James M. Carney, Yvetta D. Pols, Robert S. Antonuccio, Joseph M. Spano, William A. Izzicupo, Timothy M. Holland, Lewis B. Sheen, III, Joseph J. Montagna, Daniel D. Gonsalves
  • Patent number: 6212074
    Abstract: For a circuit board populated with numerous components having different heights, the need for numerous individual heatsinks to accommodate the circuit board's multilevel surface is eliminated. Instead, heat is transferred to a single integral heatsink via a thermal-conductive material (i.e., a thermal phase change material and/or a resilient gap filling material). A fastener secures the thermal-conductive material between the bottom portion of the heatsink and the multilevel surface, and compresses the thermal-conductive material therein, creating a thermal path sufficient to transfer heat from the multilevel surface to the heatsink so that the circuit board operates within specified design parameters.
    Type: Grant
    Filed: January 31, 2000
    Date of Patent: April 3, 2001
    Assignee: Sun Microsystems, Inc.
    Inventors: Daniel D. Gonsalves, Robert S. Antonuccio, James M. Carney, Joseph J. Montagna
  • Patent number: 6141213
    Abstract: The invention relates to a computer system and method thereof characterized by high airflow and low acoustic noise by separating the enclosure of the system into two sections, in which in one section cooling fans are arranged between power supply units and disk drives, the power supply units being located at the back of the section and the fans, as to the disk drives, serving as exhaust fans, and in the other section inlet fans are arranged to cool selected hardware electrical elements, such as CPU modules, PCI and graphics cards, wherein the placement of the inlet fans is selected to minimize pre-heated air and fan airflow paths are controlled and directed by an air dam to maximize the cooling effect, and noise damping material is employed in mounting the rack for the disk drives, the disk drives and fans and in forming the side walls of the enclosure.
    Type: Grant
    Filed: June 24, 1997
    Date of Patent: October 31, 2000
    Assignee: Sun Microsystems, Inc.
    Inventors: Robert S. Antonuccio, Thomas E. Stewart, Joseph M. Spano, Mathew J. Palazola, William A. Izzicupo, James M. Carney, Daniel D. Gonsalves, Mark R. Pugliese
  • Patent number: 5927389
    Abstract: A computer housing or electronic apparatus frame (10) includes a compartment (12) that provides space for mounting a fan assembly (14) or similar component. The fan assembly (14) is mounted on a fan tray support (16), which is removably mountable within the computer housing (10) by means of the fan tray mounts (18). Fan tray mounts (18) are oriented facing one another so that side rails (22) of fan tray (16) are slidably received by the fan tray mounts (18). The fan tray mounts (18) further includes an elongated guide channel (31) that extends the length of the fan tray mount and is formed in the inside face (30) thereof. The fan tray mounts (18) also include a first, outwardly projecting stop (52) that is positioned inwardly from end wall (38) and a second, outwardly-projecting, resiliently-deflectable stop and latch lever (54) provided adjacent end wall (36).
    Type: Grant
    Filed: June 20, 1997
    Date of Patent: July 27, 1999
    Assignee: Sun Microsystems, Inc.
    Inventors: Daniel D. Gonsalves, Robert Antonuccio, William Izzicupo, James Carney, Mark Pugliese, Joseph Spano, Matthew Palazola, David Desilets
  • Patent number: 5911596
    Abstract: An apparatus for securing a conductor to a circuit board. The conductor is configured for being soldered to the circuit board through a first aperture in the board. The apparatus includes a conductor supporting portion having a second aperture therethrough. The conductor supporting portion is configured for coupling to the circuit board. The second aperture substantially aligns with the first aperture when the conductor supporting portion is coupled to the circuit board to permit the conductor to be inserted through both the first aperture and the second aperture. The apparatus includes a tab portion configured for coupling to the conductor supporting portion. A portion of the conductor is thus held substantially immobile between the conductor supporting portion and a first edge of the tab portion when the tab portion is coupled with the conductor supporting portion, thereby preventing the conductor from being broken at the portion of the conductor when the conductor is flexed.
    Type: Grant
    Filed: February 4, 1997
    Date of Patent: June 15, 1999
    Assignee: Sun Microsystems, Inc.
    Inventors: Robert S. Antonuccio, David E. Desilets, Joseph M. Spano, Mathew J. Palazola, William A. Izzicupo, James M. Carney, Daniel D. Gonsalves, Mark R. Pugliese
  • Patent number: 5901047
    Abstract: The disclosed invention relates to the employment of a spacer element for mounting, aligning and spacing a computer chip relative to a PCB. The spacer element is formed and dimensioned to engage the chip in a manner to assure that the pins of the chip are properly aligned relative to openings in the PCB and to assure that the chip is centered and maintained parallel to the PCB and each of its pins maintained equal distance from the underneath side of the PCB during the wave soldering process for electrically connecting the chip and PCB.
    Type: Grant
    Filed: June 20, 1996
    Date of Patent: May 4, 1999
    Assignee: Sun Microsystems, Inc.
    Inventors: Daniel D. Gonsalves, Paul D. Welch, Lance E. Terry, Leonardo Sandman, Kia-Pin A. May
  • Patent number: 5434746
    Abstract: An improved attachment mechanism for attaching the motherboard in a computer system to its chassis is disclosed. The attachment mechanism includes a rail that engages at least two opposing edges of the motherboard and a hook mechanism that engages a catch formed in the chassis. The hook mechanism is secured to a central portion of the motherboard. The rail and hook mechanism cooperate to securely couple the motherboard to the chassis without requiting the use of extensive usable space on the motherboard. The described arrangement permits the motherboard to be quickly and easily installed and released.
    Type: Grant
    Filed: January 13, 1994
    Date of Patent: July 18, 1995
    Assignee: Sun Microsystems, Inc.
    Inventors: James Testa, Joseph M. Spano, William L. Dailey, Daniel D. Gonsalves, Robert S. Antonuccio, James M. Carney, Mathew J. Palazola
  • Patent number: D434030
    Type: Grant
    Filed: July 22, 1999
    Date of Patent: November 21, 2000
    Assignee: Sun Microsystems, Inc.
    Inventors: Jonathan A. Colprit, Mathew J. Palazola, Daniel D. Gonsalves, Christopher E. Chiodo