Patents by Inventor Daniel D. Johnson

Daniel D. Johnson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid chemical process for forming conductive through-holes through a dielectric layer
    Patent number: 4501638
    Abstract: A conductive through-hole hole is formed by liquid chemically etching a hole completely through a dielectric sandwiched between conductors and by deforming at least one conductor which has been undercut during the etching.
    Type: Grant
    Filed: December 5, 1983
    Date of Patent: February 26, 1985
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Daniel D. Johnson
  • Process using plasma for forming conductive through-holes through a dielectric layer
    Patent number: 4472238
    Abstract: A conductive through-hole is formed by plasma etching a hole completely through a dielectric sandwiched between conductors and by deforming at least one conductor which has been undercut during the etching.
    Type: Grant
    Filed: December 5, 1983
    Date of Patent: September 18, 1984
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Daniel D. Johnson
  • Integrated laminating process
    Patent number: 4378264
    Abstract: An integrated process for laminating a continuous layer of photosensitive composition to the surface of each member of a series of substrate elements and automatically trimming the layer from the leading and trailing edges of the laminated substrate elements.
    Type: Grant
    Filed: March 27, 1981
    Date of Patent: March 29, 1983
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Yvan P. Pilette, Daniel D. Johnson