Abstract: In accordance with one embodiment, an onboard computer (OBC) and associated circuitry capable of spoofing or mimicking a fault condition tricks an electronic control module (ECM) of an automobile or other such vehicle into implementing an engine derate procedure resulting in vehicle immobilization that is safe and that is credibly attributable to a genuine vehicle fault condition. For example, in response to an engine shutdown command, the OBC might cause a fault-spoofing engine shutdown device in one embodiment to spoof an engine overheating condition by inserting an electrical resistance in parallel with the resistance of an engine temperature sensor, thus lowering the electrical resistance of the temperature sensor as detected by the ECM.

Abstract: In accordance with one embodiment, an onboard computer (OBC) and associated circuitry capable of spoofing or mimicking a fault condition tricks an electronic control module (ECM) of an automobile or other such vehicle into implementing an engine derate procedure resulting in vehicle immobilization that is safe and that is credibly attributable to a genuine vehicle fault condition. For example, in response to an engine shutdown command, the OBC might cause a fault-spoofing engine shutdown device in one embodiment to spoof an engine overheating condition by inserting an electrical resistance in parallel with the resistance of an engine temperature sensor, thus lowering the electrical resistance of the temperature sensor as detected by the ECM.

Abstract: A PCMCIA card for use in electronic equipment includes a glass laminate circuit board including a pair of substantially planar, oppositely disposed component-mounting surfaces. Printed circuitry is designed and arranged on at least one of the component-mounting surfaces. At least one integrated circuit package is assembled onto the printed circuitry and has a length dimension direction and a shorter, width dimension direction. In order to reduce the stresses which the integrated circuit package is subjected to during handling of the PCMCIA card, the integrated circuit package is arranged on the circuit board such that the integrated circuit package length dimension direction is substantially parallel to the width dimension direction of a cooperating metal case which is part of the PCMCIA card. The assembled circuit board is encapsulated with a flexible potting compound and enclosed within the metal case to complete the PCMCIA card assembly.