Abstract: A Burn-In Board (BIB) transfer module that links a Burn-In Board (BIB) Loader/Unloader (BLU) to a burn-in chamber rack. The BIB transfer module is capable of transferring a BIB between the BLU and the burn-in chamber rack by moving the BIB in at least two perpendicular directions while minimizing the physical footprint required by the BIB transfer module. The BIB transfer module supports slot level burn-in of components as opposed to batch level burn-in because the burn-in chamber rack may begin the burn-in process as soon as a BIB is delivered to an individual chamber slot in the burn-in chamber rack. The BIB transfer module may easily be detached and separated from the BLU and the burn-in chamber rack without affecting the continuing operation of the BLU and the burn-in chamber rack.

Abstract: An apparatus and method for monitoring temperatures of multiple electronic devices under test are described herein.

Abstract: The present application relates to apparatus and methods for burn-in and other diagnostics performed on integrated circuits. In one embodiment, the invention includes a plurality of sockets, each to hold an integrated circuit (IC), and coupling power to the respective IC from a remote power supply, a plurality of voltage detectors, each coupled to a socket to sense the voltage of the power coupled to the respective IC, and a plurality of remote voltage regulators, each coupled between the power supply and a respective socket, to receive the sensed voltage from the respective voltage detector and to adjust the voltage of the respective coupled power in accordance therewith.

Abstract: A Burn-In Board (BIB) transfer module links a Burn-In Board (BIB) Loader/Unloader (BLU) to a burn-in chamber rack, The BIB transfer module is capable of transferring a BIB between the BLU and the burn-in chamber rack by moving the BIB in at least two perpendicular directions while minimizing the physical footprint required by the BIB transfer module. The BIB transfer module supports slot level burn-in of components as opposed to batch level burn-in because the burn-in chamber rack may begin the burn-in process as soon as a BIB is delivered to an individual chamber slot in the burn-in chamber rack. The BIB transfer module may easily be detached and separated from the BLU and the burn-in chamber rack without affecting the continuing operation of the BLU and the burn-in chamber rack.

Abstract: Some embodiments of the invention provide a burn-in system that links a Burn-In Board (BIB) Loader/Unloader (BLU) to a burn-in chamber rack using a BIB transfer module. The BIB transfer module is capable of transferring a BIB between the BLU and the bum-in chamber rack by moving the BIB in at least two perpendicular directions while minimizing the physical footprint required by the BIB transfer module. The system supports slot level burn-in of components as opposed to batch level burn-in because the burn-in chamber rack may begin the bum-in process as soon as a BIB is delivered to an individual chamber slot in the burn-in chamber rack. The BIB transfer module may easily be detached and separated from the BLU and the burn-in chamber rack without affecting the continuing operation of the BLU and the bum-in chamber rack. Other embodiments are described and claimed.