Patents by Inventor Daniel Davidsohn

Daniel Davidsohn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5954909
    Abstract: Process of adhering conductors such as bare copper wire, copper wire with polymide insulation, and multistrand Kapton wrapped superconductors to mount structures such as a cylinder of arbitrary cross sections, a saddle support, or steel tubes using adhesive layers of material such as BONDALL 16-H, 3M-2090 and T-164. The adhesive layers are subject to b-staging before being used, where it is heated to a temperature of approximately 60-100.degree. C. for approximately 1/2 hour to approximately one hour. The support surface can optionally be grooved to allow for better wire placement and no wire slippage.
    Type: Grant
    Filed: February 28, 1997
    Date of Patent: September 21, 1999
    Assignee: GSMA Systems, Inc.
    Inventors: Daniel Davidsohn, Scott Lundy, Rainer Meinke, Gerald Stelzer, Mark W. Senti