Patents by Inventor Daniel De Zutter

Daniel De Zutter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND DEVICE FOR GENERATING A MODEL OF A MULTIPARAMETER SYSTEM
    Publication number: 20100280801
    Abstract: The present invention relates to a method (200) for generating a multivariate system model of a multivariate system which has a plurality of parameters and the multivariate system model is representative for the system response to changes in the parameters. The method (200) involves performing a plurality of measurements and/or simulations on the multivariate system to obtain reference data (201). The method further involves the selection of rational base functions (202) and combining these base functions (203) into a model of the multivariate system. The multivariate system model is obtained (208) by minimizing a cost function (205) between the model and the reference data. Explicit weight factors which are related to the reference data are used. The respective values for the explicit weight factors in the cost function are iteratively determined (205) in order to approximate the reference data with the model and the cost function is updated accordingly in each iteration.
    Type: Application
    Filed: August 11, 2008
    Publication date: November 4, 2010
    Inventors: Dirk Deschrijver, Tom Dhaene, Daniël De Zutter
  • Modelling current flows in three-dimensional conductive and dielectric bodies
    Patent number: 7331023
    Abstract: Current flows in a three-dimensional conductive or dielectric body embedded in a substrate of a different material are modelled in terms of surface currents induced in planar surfaces bounding the body and composed of the same material as the substrate, the surfaces having appropriate values for surface impedance.
    Type: Grant
    Filed: March 1, 2005
    Date of Patent: February 12, 2008
    Assignee: Agilent Technologies, Inc.
    Inventors: Jeannick Sercu, Jan Van Hese, Daniel De Zutter, Luc Knockaert
  • Modelling current flows in three-dimensional conductive and dielectric bodies
    Publication number: 20050198599
    Abstract: Current flows in a three-dimensional conductive or dielectric body embedded in a substrate of a different material are modelled in terms of surface currents induced in planar surfaces bounding the body and composed of the same material as the substrate, the surfaces having appropriate values for surface impedance.
    Type: Application
    Filed: March 1, 2005
    Publication date: September 8, 2005
    Inventors: Jeannick Sercu, Jan Van Hese, Daniel De Zutter, Luc Knockaert
  • Packaged integrated circuit
    Publication number: 20010052645
    Abstract: A Packaged Integrated Circuit, for use in a radio frequency apparatus, the Packaged Integrated Circuit comprises one or more radio frequency components that are included in an Integrated Circuit die. The Integrated Circuit die is associated with a radio frequency antenna. The radio frequency antenna is also included in the Packaged Integrated Circuit but is excluded from the Integrated Circuit die.
    Type: Application
    Filed: February 16, 2001
    Publication date: December 20, 2001
    Inventors: Frank Nico Lieven Op'T Eynde, Willy Gerard Joseph Yolande Dehaeck, Ilse Wuyts, Steven Gerd Alexander Terryn, Frank Olyslager, Hendrick Rogier, Daniel De Zutter, Rick Van Vliet