Abstract: In one implementation, a method is provided for constructing an interface module which includes constructing a board having a signal via through the board, and having at least one ground via extending through the board. The method further includes back drilling the signal via to create a center conductor hole above a remaining portion of the signal via and back drilling a shield opening in the board and at least part way into the at least one ground via such that a height of the center conductor hole is reduced. The method further includes plating the shield opening and the center conductor hole, and back drilling to remove a portion of the plating to electrically isolate the plated shield opening and the plated center conductor hole.

Abstract: In one embodiment, an interface module is provided for connecting a plurality of signal paths to a high signal density interface. The interface module includes a board having axial conductor receptacles. The axial conductor receptacles have at least one ground via extending through the board to an interface side of the board and a shield receiving hole in the board extending into the board from a cable side of the board. At least a portion of the at least one ground via being exposed within the shield receiving hole, the shield receiving hole having a plating therein contacting the portion of the at least one ground via exposed within the shield receiving hole. The axial conductor receptacles have a plated center conductor receiving hole in the board, which extends to a signal via. The signal via extends from the center conductor hole to the interface side of the board. A non-plated hole in the board is located between the plated center conductor hole and the shield receiving hole.

Abstract: In one implementation, a method is provided for constructing an interface module which includes constructing a board having a signal via through the board, and having at least one ground via extending through the board. The method further includes back drilling the signal via to create a center conductor hole above a remaining portion of the signal via and back drilling a shield opening in the board and at least part way into the at least one ground via such that a height of the center conductor hole is reduced. The method further includes plating the shield opening and the center conductor hole, and back drilling to remove a portion of the plating to electrically isolate the plated shield opening and the plated center conductor hole.

Abstract: In one embodiment, an interface module is provided for connecting a plurality of signal paths to a high signal density interface. The interface module includes a board having axial conductor receptacles. The axial conductor receptacles have at least one ground via extending through the board to an interface side of the board and a shield receiving hole in the board extending into the board from a cable side of the board. At least a portion of the at least one ground via being exposed within the shield receiving hole, the shield receiving hole having a plating therein contacting the portion of the at least one ground via exposed within the shield receiving hole. The axial conductor receptacles have a plated center conductor receiving hole in the board, which extends to a signal via. The signal via extends from the center conductor hole to the interface side of the board. A non-plated hole in the board is located between the plated center conductor hole and the shield receiving hole.

Abstract: An electrical connector for connection to multiple cables comprises, multiple conductor elements (36), and multiple insulating separator elements (38) separating the conductor elements (36) from each other, body portions (40) of the conductor elements (36) and the separator elements (38) are fabricated from sheets of material laminated together, an array of spaced apart spring contact portions (22) project from the body portions (40), and an array of spaced apart termination portions (56) project from the body portions (40) for connection to respective conductors of multiple cables, and a transverse shield (48) extending across edges on the conductor elements (36) and edges on the separator elements (38).

Abstract: Connectors for attachment to cables including a large number of very small flexible conductors (26) or coaxial conductor pairs (74). In a first embodiment very small contacts (36) are arrayed on a flat mating surface (28) of the connector body (22). Contacts (36) are raised slightly above the mating surface by plating conductive metal to form raised bumps (42) on one of a pair of connectors (14, 16). Insulated individual conductors (26) are placed through apertures (48) defined in a substrate acting as a template, and are fastened in place by potting material (50) before shaping the mating surface (28) of the connector body (22) or (24) is shaped. Pin and socket combinations (30, 32) are used to align mating connectors with each other.

Abstract: Connectors for attachment to cables including a large number of very small flexible conductors or conductor pairs, in which very small contacts are provided as an array exposed on a flat mating surface. Contacts may be raised slightly above the flat surface by plating conductive metal to form raised bumps on one of a pair of connectors. Individual conductors are placed through apertures defined in a substrate acting as a template, and are potted in place before shaping the mating surface of the connector. Contact bases to be plated may be defined precisely by photoresist lithography on a cover layer attached to the template substrate, and an elastomeric layer may be provided between the cover layer and the template substrate. Pin and socket combinations are used to align mating connectors with each other.

Abstract: A test fixture for testing microstrip assemblies and similar electronic circuit components and assemblies under application of high-frequency signals introduced through launchers whose positions are adjustable in the test fixture to accommodate circuit assemblies of different sizes and different geometry. An easily operated rapid connector positioning mechanism moves connectors which complete electrical connection between outer conductors of the launchers and a ground plane conductor of a microstrip assembly. The connectors also lift the microstrip assembly and support it while electrical connection is completed, without the need for a carrier beneath the test assembly. A lid is moved in coordination with operation of the connector positioning mechanism to provide electrical contact to a third point on the upper face of a circuit assembly to be tested.