Patents by Inventor Daniel Derrick Gonsalves

Daniel Derrick Gonsalves has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5957465
    Abstract: A PCI card is inserted through an I/O opening in a computer panel. On one edge of the card is a cover from one end of which projects a tab. A resilient gasket is attached to the panel to create a flexible EMC seal around the opening. Preferably the gasket is formed of tin-plated beryllium copper. The gasket has alternate staggered spring fingers oriented opposite to the direction of insertion of the PCI card. To retain the gasket the panel is formed with slots at either end and an outward struck projection at the middle. The gasket is formed with a tongue at either end to be inserted in one of the slots and a punched-out opening to receive the projection.
    Type: Grant
    Filed: June 17, 1997
    Date of Patent: September 28, 1999
    Assignee: Sun Microsystems, Inc.
    Inventors: Daniel Derrick Gonsalves, Kenneth Kitlas, Robert Antonnucio, William Izzicupo, James Carney, Mark Pugliese, Joseph Spano, Mathew Palazola, David Desilets
  • Patent number: 5867369
    Abstract: A composite computer housing protects electronic components against shock and vibration. The housing has a midplane which divides the housing into a chassis section and a mainboard section. The chassis section holds hard disk drives. The mainboard section holds a mainboard, cards, a processor unit and other electronic components. A composite side cover assembly, having multiple layers, encloses the housing and provides a shell to inhibit flexion of the housing. The side cover presses against any number of the electronic components in the mainboard section to minimize vibration of these components and to enable the electronic components to provide internal support to the housing.
    Type: Grant
    Filed: July 15, 1997
    Date of Patent: February 2, 1999
    Assignee: Sun Microsystems, Inc.
    Inventors: Robert Salvatore Antonuccio, Thomas E. Stewart, Joseph M. Spano, Mathew John Palazola, William Anthony Izzicupo, James Maurice Carney, Daniel Derrick Gonsalves, Mark Richard Pugliese
  • Patent number: 5839584
    Abstract: A structural foam, injection molded superstructure is attached to a motherboard by means of threaded inserts. The superstructure is formed with guide ways for CPU processor modules, and also for the edges of PCI cards. Features of the structure include cam levers on the CPU modules to install and extract the modules. A metal transverse vertical retaining bracket is attached to the superstructure to hold sides thereof parallel and prevent splaying of the free, open end of the superstructure upon extraction of CPU processor modules. The assembly provides stiffness to the motherboard.
    Type: Grant
    Filed: June 9, 1997
    Date of Patent: November 24, 1998
    Assignee: Sun Microsystems, Inc.
    Inventors: Daniel Derrick Gonsalves, Robert Antonnucio, William Izzicupo, James Carney, Mark Pugliese, Joseph Spano, Mathew Palazola, David Desilets