Abstract: Method and systems for cleaning and wetting a semiconductor substrate, are provided. Methods and systems include forming an atmosphere in a basin housing the semiconductor substrate with a gas having a higher solubility in a wetting agent than oxygen. Methods and systems include spraying the wetting agent with a spray head onto the substrate while maintaining the atmosphere. Methods and systems include rotationally translating the semiconductor substrate, the spray head, or both the semiconductor substrate and the spray head, Methods and systems include wetting a plurality of features defined in the substrate.

Abstract: Method and systems for cleaning and wetting a semiconductor substrate, are provided. Methods and systems include forming an atmosphere in a basin housing the semiconductor substrate with a gas having a higher solubility in a wetting agent than oxygen. Methods and systems include spraying the wetting agent with a spray head onto the substrate while maintaining the atmosphere. Methods and systems include rotationally translating the semiconductor substrate, the spray head, or both the semiconductor substrate and the spray head, Methods and systems include wetting a plurality of features defined in the substrate.

Abstract: Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.

Abstract: Method and systems for cleaning and wetting a semiconductor substrate, are provided. Methods and systems include forming an atmosphere in a basin housing the semiconductor substrate with a gas having a higher solubility in a wetting agent than oxygen. Methods and systems include spraying the wetting agent with a spray head onto the substrate while maintaining the atmosphere. Methods and systems include rotationally translating the semiconductor substrate, the spray head, or both the semiconductor substrate and the spray head, Methods and systems include wetting a plurality of features defined in the substrate.

Abstract: Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.

Abstract: Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.

Abstract: Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.

Abstract: A single wafer processor supports a semiconductor wafer having at least one surface that is to be subjected to contact with a fluid. The equipment includes a portable module including a gripper assembly that is rotatable about the axis of a portable housing and is capable of mechanically engaging or disengaging the edge of an individual wafer. The portable module is complementary to a receiving base having an open bowl provided with liquid jets for discharging processing liquids or reagents in parallel streams directed toward the outer surface of a rotating wafer. The bowl can also be filled with liquid for immersion treatment of a wafer, which can be held stationary or rotated at slow speeds. The portable unit is moved between base units by a robotic arm. All elements associated with holding of the wafer are physically shielded to minimize wafer contamination from environmental contact.

Abstract: A single wafer processor supports a semiconductor wafer having at least one surface that is to be subjected to contact with a fluid. The equipment includes a portable module including a gripper assembly that is rotatable about the axis of a portable housing and is capable of mechanically engaging or disengaging the edge of an individual wafer. The portable module is complementary to a receiving base having an open bowl provided with liquid jets for discharging processing liquids or reagents in parallel streams directed toward the outer surface of a rotating wafer. The bowl can also be filled with liquid for immersion treatment of a wafer, which can be held stationary or rotated at slow speeds. The portable unit is moved between base units by a robotic arm. All elements associated with holding of the wafer are physically shielded to minimize wafer contamination from environmental contact.

Abstract: A single wafer processor supports a semiconductor wafer having at least one surface that is to be subjected to contact with a fluid. The equipment includes a portable module including a gripper assembly that is rotatable about the axis of a portable housing and is capable of mechanically engaging or disengaging the edge of an individual wafer. The portable module is complementary to a receiving base having an open bowl provided with liquid jets for discharging processing liquids or reagents in parallel streams directed toward the outer surface of a rotating wafer. The bowl can also be filled with liquid for immersion treatment of a wafer, which can be held stationary or rotated at slow speeds. The portable unit is moved between base units by a robotic arm. All elements associated with holding of the wafer are physically shielded to minimize wafer contamination from environmental contact.