Patents by Inventor Daniel DURMEK

Daniel DURMEK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKING STRUCTURE AND PREPARATION DEVICE THEREOF, ENCAPSULATION MOLD AND VEHICLE WINDOW ASSEMBLY
    Publication number: 20240198565
    Abstract: A packaging structure includes a main body adapted to be installed in an encapsulation mold and provided with an attachment surface to attach to at least part of a surface of a glass to be encapsulated, and a lip extending from the attachment surface of the main body to be suitable for sealing the surface of the glass, wherein at least a part of the packaging structure is made of flexible material.
    Type: Application
    Filed: June 1, 2022
    Publication date: June 20, 2024
    Inventors: Hailong ZHANG, Daniel DURMEK