Patents by Inventor Daniel E. Baxter

Daniel E. Baxter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11911045
    Abstract: A method for adjusting control parameters of a clip applier using a surgical hub is disclosed. The method comprises gathering data during a first surgical procedure, evaluating the gathered data to determine the appropriate operation of a clip applier in a subsequent surgical procedure, gathering data during the operation of the clip applier in the subsequent surgical procedure, determining if the operation of the clip applier needs to be adjusted based on the data gathered during the subsequent surgical procedure, and adjusting the operation of the clip applier based on the data gathered during the subsequent surgical procedure.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: February 27, 2024
    Assignee: Cllag GmbH International
    Inventors: Frederick E. Shelton, IV, Michael J. Stokes, Gregory G. Scott, Nicholas M. Morgan, Disha V. Estera, Jason L. Harris, Chester O. Baxter, III, Daniel J. Mumaw
  • Patent number: 6085415
    Abstract: Methods for the production of insulated, conductive through-features in conductive core materials for electronics packaging are disclosed. Invention methods employ protective mask technology in order to facilitate the selective removal of material from planar conductive core material that has been encapsulated in electrically insulated materials. By filling the cavity in the conductive core material with an electrically insulated material, the through-feature is electrically isolated from the remainder of the core material. In this manner, a conductive through-feature that completely transverses the core of the substrate board is created. Also provided are planar substrates for multilayer printed circuit boards, or chip carriers, comprising the conductive through-features produced by invention methods.
    Type: Grant
    Filed: July 27, 1998
    Date of Patent: July 11, 2000
    Assignee: Ormet Corporation
    Inventors: Pradeep Gandhi, Samuel Fu, Gary E. Legerton, Daniel E. Baxter, William C. Robinette