Abstract: A thermal barrier coated radio frequency (RF) radome is provided having a radio frequency (RF) radome with an exterior surface, an interior surface, a tip, and a base, wherein the RF radome is designed to transmit RF signals. A thermal barrier coating is applied to an exterior surface of the radome, wherein the thermal barrier coating has a dielectric constant of less than about 2.0, and further wherein the thermal barrier coating reduces a structure temperature of the RF radome by greater than 300 degrees Fahrenheit to enhance thermo-mechanical properties and performance of the RF radome.

Abstract: A passive non-ablating thermally protective structure body is disclosed. An improved-reliability heat pipe edge comprises a non-porous material formed into a wedge-shaped chamber, and a porous layer. The porous layer extends from interior surfaces of the non-porous material to provide capillary wicking.

Abstract: Thermal barrier coated RF radomes and a method for making the same are provided. In an embodiment of the disclosure, there is provided a method for making a thermal barrier coated radio frequency (RF) radome. The method comprises providing a radio frequency (RF) radome. The method further comprises applying a thermal barrier coating having a dielectric constant less than about 2.0 onto a surface of the radome to form a thermal barrier coated RF radome. The thermal barrier coating reduces a structure temperature of the radome by greater than 300 degrees Fahrenheit to enhance thermo-mechanical properties and performance of the RF radome.

Abstract: Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by sintering a stack of individual copper and tungsten powder blend layers having progressively higher copper content/tungsten content, by volume, ratio values in successive powder blend layers in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.

Abstract: Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by thermal plasma spraying mixtures of copper powder and tungsten powder in a varied blending ratio such that the blending ratio of the copper powder and the tungsten powder that is fed to a plasma torch is intermittently adjusted to provide progressively higher copper content/tungsten content, by volume, ratio values in the interlayer in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.

Abstract: Process for bonding a metal brush structure to a planar surface of a metal substrate in which an array of metal rods are retained and immobilized at their tips by a common retention layer formed of metal, and the brush structure is then joined to a planar surface of a metal substrate via the retention layer.