Patents by Inventor Daniel E. Killian

Daniel E. Killian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal cooling of industrial electronic module by conductive structure
    Patent number: 7525798
    Abstract: An electronic module and chassis/module installation and cooling method are disclosed. The installation comprises a chassis including a metallic heat input region. An electronic module including an electronic component is adapted to be connected to the chassis. An uninterrupted thermal pathway thermally connects the electronic component of the module to the heat input region of the chassis. The thermal pathway comprises a chimney, a heat channel thermally connected to the chimney, and a heat output block thermally connected to the heat channel. A first electrically insulative non-metallic layer thermally couples the chimney to the electronic component. A second electrically insulative non-metallic layer thermally couples the heat output block to the chassis heat input region.
    Type: Grant
    Filed: June 17, 2008
    Date of Patent: April 28, 2009
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Ronald E. Schultz, Kenwood H. Hall, Patrick C. Herbert, Douglas R. Bodmann, Daniel E. Killian
  • Thermal cooling of industrial electronic module by conductive structure
    Publication number: 20080253086
    Abstract: An electronic module and chassis/module installation and cooling method are disclosed. The installation comprises a chassis including a metallic heat input region. An electronic module including an electronic component is adapted to be connected to the chassis. An uninterrupted thermal pathway thermally connects the electronic component of the module to the heat input region of the chassis. The thermal pathway comprises a chimney, a heat channel thermally connected to the chimney, and a heat output block thermally connected to the heat channel. A first electrically insulative non-metallic layer thermally couples the chimney to the electronic component. A second electrically insulative non-metallic layer thermally couples the heat output block to the chassis heat input region.
    Type: Application
    Filed: June 17, 2008
    Publication date: October 16, 2008
    Inventors: Ronald E. Schultz, Kenwood H. Hall, Patrick C. Herbert, Douglas R. Bodmann, Daniel E. Killian
  • Thermal cooling of industrial electronic module by conductive structure
    Patent number: 7391610
    Abstract: An electronic module and chassis/module installation are disclosed. The installation comprises a chassis including a metallic heat input region. An electronic module including an electronic component is adapted to be connected to the chassis. An uninterrupted thermal pathway thermally connects the electronic component of the module to the heat input region of the chassis. The thermal pathway comprises a chimney, a heat channel thermally connected to the chimney, and a heat output block thermally connected to the heat channel. A first electrically insulative non-metallic layer thermally couples the chimney to the electronic component. A second electrically insulative non-metallic layer thermally couples the heat output block to the chassis heat input region.
    Type: Grant
    Filed: September 29, 2006
    Date of Patent: June 24, 2008
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Ronald E. Schultz, Kenwood H. Hall, Patrick C. Herbert, Douglas R. Bodmann, Daniel E. Killian
  • Thermal Cooling of Industrial Electronic Module by Conductive Structure
    Publication number: 20080080134
    Abstract: An electronic module and chassis/module installation are disclosed. The installation comprises a chassis including a metallic heat input region. An electronic module including an electronic component is adapted to be comnected to the chassis. An uninterrupted thermal pathway thermally connects the electronic component of the module to the heat input region of the chassis. The thermal pathway comprises a chimney, a heat channel thermally connected to the chimney, and a heat output block thermally connected to the heat channel A first electrically insulative non-metallic layer thermally couples the chimney to the electronic component. A second electrically insulative non-metallic layer thermally couples the heat output block to the chassis heat input region.
    Type: Application
    Filed: September 29, 2006
    Publication date: April 3, 2008
    Applicant: ROCKWELL AUTOMATION TECHNOLOGIES, INC.
    Inventors: Ronald E. Schultz, Kenwood H. Hall, Patrick C. Herbert, Douglas R. Bodmann, Daniel E. Killian