Patents by Inventor Daniel E. Sanchez

Daniel E. Sanchez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Devices for methodologies related to wafer carriers
    Patent number: 9576838
    Abstract: Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: February 21, 2017
    Assignee: Skyworks Solutions, Inc.
    Inventors: Elena Becerra Woodard, Daniel Kwadwo Amponsah Berkoh, David James Zapp, Steve Canale, Hyong Yong Lee, Daniel E. Sanchez, Hung V. Phan
  • Debonders and related devices and methods for semiconductor fabrication
    Patent number: 8758552
    Abstract: Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: June 24, 2014
    Assignee: Skyworks Solutions, Inc.
    Inventors: Steve Canale, David J. Zapp, Daniel E. Sanchez, Hung V. Phan, Hyong Y. Lee
  • DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICATION
    Publication number: 20110297329
    Abstract: Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed.
    Type: Application
    Filed: October 5, 2010
    Publication date: December 8, 2011
    Applicant: SKYWORKS SOLUTIONS, INC.
    Inventors: Steve Canale, David J. Zapp, Daniel E. Sanchez, Hung V. Phan, Hyong Y. Lee