Abstract: A heatsink grounding mechanism and an associated circuit card and computer system. The circuit card includes a printed circuit board to an integrated circuit module is attached. A heatsink is positioned in contact with or in close proximity to the integrated circuit module package. A heatsink grounding piece of the grounding mechanism is utilized to ground the heatsink. The grounding piece includes a substantially rectangular and conductive grounding piece ring that defines an aperture. The dimensions are suitable for receiving and circumventing the integrated circuit module. The grounding piece includes a set of semi-rigid conductive spring arms that extend away from the grounding piece ring. The spring arms are positioned and oriented such that termination points of the spring arms contact grounding pads on the printed circuit board when the grounding piece is compressed between the heatsink and the circuit board.