Patents by Inventor Daniel Elkaslassy

Daniel Elkaslassy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device diagnosis
    Patent number: 10929261
    Abstract: A technology is described for a device diagnosis station. The device diagnosis station may be configured to identify an electronic device physically connected to the device diagnosis station, evaluate an operational state of the electronic device by executing testing instructions configured to test the functionality of the electronic device and collect operational state information for the electronic device. The device diagnosis station may be configured to determine the operational state of the electronic device and execute recovery instructions to restore the electronic device to an improved state when a recoverable error is detected. The device diagnosis station may be configured to initiate a device return procedure for the electronic device when a non-recoverable error state is detected.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: February 23, 2021
    Assignee: Amazon Technologies, Inc.
    Inventors: Alex Levin, Ziv Harel, Evgeny Khanin, David Ben-Dror, Georgy Machulsky, Daniel Elkaslassy, Sergei Shtern
  • Heat dissipating high power systems
    Patent number: 9408308
    Abstract: An electronic system includes a printed circuit board (PCB), and a heat dissipating element. The PCB includes one or more first electronic components mounted on a first side of the PCB, and one or more second electronic components mounted on a second side of the PCB. The first electronic components have a power consumption that is greater than a threshold and have a height over the first side of the PCB that is higher than any other electronic components mounted on the first side of the PCB. At least one of the second electronic components has a height over the second side of the PCB that is higher than the height of the first electronic components. The heat dissipating element is adjacent to the first electronic components so as to provide a thermal coupling for dissipating heat generated by the first electronic components.
    Type: Grant
    Filed: January 5, 2015
    Date of Patent: August 2, 2016
    Assignee: Marvell Israel (M.I.S.L) Ltd.
    Inventors: Daniel Elkaslassy, Daniel Kalmanoviz
  • HEAT DISSIPATING HIGH POWER SYSTEMS
    Publication number: 20150109750
    Abstract: An electronic system includes a printed circuit board (PCB), and a heat dissipating element. The PCB includes one or more first electronic components mounted on a first side of the PCB, and one or more second electronic components mounted on a second side of the PCB. The first electronic components have a power consumption that is greater than a threshold and have a height over the first side of the PCB that is higher than any other electronic components mounted on the first side of the PCB. At least one of the second electronic components has a height over the second side of the PCB that is higher than the height of the first electronic components. The heat dissipating element is adjacent to the first electronic components so as to provide a thermal coupling for dissipating heat generated by the first electronic components.
    Type: Application
    Filed: January 5, 2015
    Publication date: April 23, 2015
    Applicant: Marvell Israel (M.I.S.L) Ltd.
    Inventors: Daniel ELKASLASSY, Daniel KALMANOVIZ
  • Heat dissipating high power systems
    Patent number: 8929081
    Abstract: An electronic system includes a printed circuit board (PCB), and a heat dissipating element. The PCB includes one or more first electronic components mounted on a first side of the PCB, and one or more second electronic components mounted on a second side of the PCB. The first electronic components have a power consumption that is greater than a threshold and have a height over the first side of the PCB that is higher than any other electronic components mounted on the first side of the PCB. At least one of the second electronic components has a height over the second side of the PCB that is higher than the height of the first electronic components. The heat dissipating element is adjacent to the first electronic components so as to provide a thermal coupling for dissipating heat generated by the first electronic components.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: January 6, 2015
    Assignee: Marvell Israel (M.I.S.L) Ltd.
    Inventors: Daniel Elkaslassy, Daniel Kalmanoviz
  • HEAT DISSIPATING HIGH POWER SYSTEMS
    Publication number: 20120314374
    Abstract: An electronic system includes a printed circuit board (PCB), and a heat dissipating element. The PCB includes one or more first electronic components mounted on a first side of the PCB, and one or more second electronic components mounted on a second side of the PCB. The first electronic components have a power consumption that is greater than a threshold and have a height over the first side of the PCB that is higher than any other electronic components mounted on the first side of the PCB. At least one of the second electronic components has a height over the second side of the PCB that is higher than the height of the first electronic components. The heat dissipating element is adjacent to the first electronic components so as to provide a thermal coupling for dissipating heat generated by the first electronic components.
    Type: Application
    Filed: March 12, 2012
    Publication date: December 13, 2012
    Inventors: Daniel Elkaslassy, Daniel Kalmanoviz