Patents by Inventor Daniel Engelhard

Daniel Engelhard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050007577
    Abstract: A correlation between develop inspect (DI) and final inspect (FI) profile parameters are established empirically with test wafers. During production, a wafer is measured at DI phase to obtain DI profile parameters and FI phase profile parameters are predicted according to the DI profile parameters and the established correlation. Each wafer is subsequently measured at FI phase to obtain actual FI profile parameters and the correlation is updated with actual DI and FI profile parameters.
    Type: Application
    Filed: August 2, 2004
    Publication date: January 13, 2005
    Applicant: Timbre Technologies, Inc.
    Inventors: Daniel Engelhard, Manuel Madriaga