Abstract: A single layer ceramic capacitor for wire bonding or solder or epoxy attachment wherein a bottom metallization is of a lesser purity than a top metallization whereby the bottom metallization may be effectively soldered without leaching of the metal and the top metallization may be wire bonded. In an exemplary embodiment, the top metallization is essentially pure gold and the bottom metallization is an alloy of gold and platinum and/or palladium. The top and bottom metallizations are provided on a dielectric body that advantageously comprises a ceramic having a sintering temperature below the melting point of gold. In a further exemplary embodiment, the capacitance of the capacitor may be enhanced by providing one or more interior metallization planes parallel to the exterior metallizations and connected thereto by conductive vias.

Abstract: A high voltage capacitor has a monolithic body made of layers of dielectric material and further has first and second external contacts located on the body. First and second nonoverlapping electrodes electrically connected to the respective first and second contacts are located on respective first and second layers of dielectric material within the body. A floating electrode not connected to either of the contacts is located on a different, third layer of dielectric material. The floating electrode overlaps the first and second electrodes and forms two serially connected capacitors therewith.

Abstract: A high voltage capacitor has a monolithic body made of layers of dielectric material and further has first and second external contacts located on the body. First and second nonoverlapping electrodes electrically connected to the respective first and second contacts are located on respective first and second layers of dielectric material within the body. A floating electrode not connected to either of the contacts is located on a different, third layer of dielectric material. The floating electrode overlaps the first and second electrodes and forms two serially connected capacitors therewith.

Abstract: A feed-through capacitor has layers of dielectric material and a first hole that passes through the layers of dielectric material for receiving an electrical conductor connected to the filter capacitor. First, second and third electrodes are disposed between layers of the dielectric material and extend in a first direction substantially perpendicular to a centerline of the first hole. The third electrodes are disposed intermediate the first and second electrodes. Any one of the first, second and third electrodes is non-overlapping with any of another of the first, second and third electrodes in a direction substantially parallel to the centerline of the first hole. A filtering capacitor is formed substantially wholly by fringe-effect capacitance between the first and third electrodes, and a coupling capacitor is formed substantially wholly by fringe-effect capacitance between the second and third electrodes. The filtering and coupling are electrically connected in series.

Abstract: The size and placement of internal metallization areas as do collectively form each of two electrodes is improved in a typically discoidal feed-through ceramic filter capacitor having (i) multiple ceramic layers, (ii) a hole passing a wire that carries electrical signals which are to be filtered, (iii) metal lining the hole so as to make electrical contact with the wire, and (iv) an exterior metal band connected to ground. First internal metallization areas, each in the shape of a relatively smaller small-aperture disk, are centered about the body's hole in contact with the metal lining, each area being upon one of the body's multiple ceramic layers, the areas collectively serving as a first electrode of the capacitor.

Abstract: A feed-through capacitor has layers of dielectric material and a first hole that passes through the layers of dielectric material for receiving an electrical conductor connected to the filter capacitor. First, second and third electrodes are disposed between layers of the dielectric material and extend in a first direction substantially perpendicular to a centerline of the first hole. The third electrodes are disposed intermediate the first and second electrodes Any one of the first, second and third electrodes is non-overlapping with any of another of the first, second and third electrodes in a direction substantially parallel to the centerline of the first hole. A filtering capacitor is formed substantially wholly by fringe-effect capacitance between the first and third electrodes, and a coupling capacitor is formed substantially wholly by fringe-effect capacitance between the second and third electrodes The filtering and coupling are electrically connected in series.

Abstract: The size and placement of internal metallization areas as do collectively form each of two electrodes is improved in a typically discoidal feed-through ceramic filter capacitor having (i) multiple ceramic layers, (ii) a hole passing a wire that carries electrical signals which are to be filtered, (iii) metal lining the hole so as to make electrical contact with the wire, and (iv) an exterior metal band connected to ground. First internal metallization areas, each in the shape of a relatively smaller small-aperture disk, are centered about the body's hole in contact with the metal lining, each area being upon one of the body's multiple ceramic layers, the areas collectively serving as a first electrode of the capacitor.

Abstract: Metal, normally gold or platinum, is printed, and is adhered by a glass frit, on the top and/or bottom surfaces of a multi-layer laid-up green ceramic wafers containing typically up to 16 layers and 800+ separate devices, typically 800+ monolithic, buried-substrate, ceramic multiple capacitors. The wafer is diced, and the multiple ceramic capacitors each with its patterned surface metal are co-fired. The integrally formed, top and bottom surface, conduction traces connect similarly formed pads, typically disposed in a "pin-grid" pattern, to later-added side traces or conductive castellations that connect to the electrodes of multiple buried-substrate capacitors. The pads are precisely located, and extend over such ample areas, to support the stable surface mounting, and the reliable electrical connection of, diverse external electrical circuits and components.

Abstract: Leaded electrical circuits and components, typically receivers and amplifiers used in micro-miniature hearing aids, are closely physically mounted by their leads extending within laser-drilled through-holes, typically three such holes, to multiple buried-substrate capacitors within a monolithic ceramic multiple capacitor. Electrical connection to the leads does not transpire within the holes, but rather though soldered or like connection to conductive pads surrounding the holes and continuing first as circuit traces on the top of the monolith, and then as electrically-conductive trace or castellations on the sides of the monolith, until reaching electrodes of the buried-substrate capacitors patterned so as to be brought to side surfaces of the monolith. The direct electrical connection is normally to multiple plates of plural buried-substrate capacitors, typically including a relatively large, typically 1.0 .mu.farad, capacitor in electrical parallel with a smaller, typically 100 picofarads, capacitor.

Abstract: A monolithic, buried-substrate, ceramic multiple capacitor is laid up as multiple capacitors that are isolated, one to the next, by a dual-dielectric-constant, three-layer-laminate, isolation layer. Each isolation layer has and presents (i) an innermost layer of a low dielectric constant (low K) material, located between (ii) outer laminate layers of a high dielectric constant (high K) material. By such construction negative effects of the physio-chemical reaction (i) occurring at the boundary between the high-K and low-K layers, (ii) contaminating the high-K dielectric and lowering its K, and (iii) undesirably serving both to lower the capacitance of any (buried substrate) capacitor that makes use of the ("contaminated") high-K dielectric while increasing capacitor leakage current, are mitigated or avoided.

Abstract: A monolithic multiple ceramic capacitor is made by interspersing layers of green tape containing ceramic powder in a binder with printed layers of electrical conductors, then compressing the layers and heating them to sinter the ceramic powder. Edge connections link the conducting layers in predetermined patterns to provide external connections to the capacitors. Use of parasitic or stray capacitance between pairs of external terminals provides additional useful values of capacitance. Unwanted stray capacitance between adjacent terminals is reduced by making slots by saw cuts or the like in either the green tape or the sintered material. Unwanted stray capacitance between elements inside the capacitor is reduced by ground planes between layers of capacitors and by layers of ceramic materials having relatively low dielectric constants to separate layers of capacitors, to form exterior layers of insulating material, or both.