Patents by Inventor Daniel F. Vitellaro

Daniel F. Vitellaro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid seeders for electroless metal deposition
    Patent number: 4222778
    Abstract: Novel liquid seeders and catalyzation processes for the electroless deposition of metal on substrates. The seeders comprise the admixture of sources of cuprous, hydrogen and halogen ions, organic solvent(s), and an agent to convert cupric ions to cuprous ions. The processes include the steps of contacting a substrate with a certain seeder, fixing the seeder to the substrate with water, and catalyzing the fixed seeder by further water treatment, use of a strong reducing agent, or both.
    Type: Grant
    Filed: March 30, 1979
    Date of Patent: September 16, 1980
    Assignee: Kollmorgen Technologies Corporation
    Inventors: Francis J. Nuzzi, Daniel F. Vitellaro
  • Catalyzation processes for electroless metal deposition
    Patent number: 4160050
    Abstract: Novel liquid seeders and catalyzation processes for the electroless deposition of metal on substrates. The seeders comprise the admixture of sources of cuprous, hydrogen and halogen ions, organic solvent(s), and an agent to convert cupric ions to cuprous ions. The processes include the steps of contacting a substrate with a certain seeder, fixing the seeder to the substrate with water, and catalyzing the fixed seeder by further water treatment, use of a strong reducing agent, or both.
    Type: Grant
    Filed: February 18, 1977
    Date of Patent: July 3, 1979
    Assignee: Kollmorgen Technologies Corporation
    Inventors: Francis J. Nuzzi, Daniel F. Vitellaro