Patents by Inventor Daniel Frech

Daniel Frech has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Slotted substrate and method of making
    Patent number: 7501070
    Abstract: The described embodiments relate to a slotted substrate for use in a fluid ejecting device. One exemplary embodiment includes a substrate having a thickness between generally opposing first and second surfaces. A slot received in the substrate. The slot has a central region joined with at least one terminal region. The central region extends between the first and second surfaces. The at least one terminal region includes, at least in part, a bowl-shaped portion that has a diameter at the first surface greater than a width of the central region at the first surface.
    Type: Grant
    Filed: August 18, 2003
    Date of Patent: March 10, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Shen Buswell, Deanna J. Bergstrom, Daniel Frech
  • Slotted substrate and method of making
    Patent number: 6814431
    Abstract: The described embodiments relate to a slotted substrate for use in a fluid ejecting device. One exemplary embodiment includes a substrate having a thickness between generally opposing first and second surfaces. A slot received in the substrate. The slot has a central region joined with at least one terminal region. The central region extends between the first and second surfaces. The at least one terminal region includes, at least in part, a bowl-shaped portion that has a diameter at the first surface greater than a width of the central region at the first surface.
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: November 9, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Shen Buswell, Deanna J. Bergstrom, Daniel Frech
  • Slotted substrate and method of making
    Publication number: 20040031151
    Abstract: The described embodiments relate to a slotted substrate for use in a fluid ejecting device. One exemplary embodiment includes a substrate having a thickness between generally opposing first and second surfaces. A slot received in the substrate. The slot has a central region joined with at least one terminal region. The central region extends between the first and second surfaces. The at least one terminal region includes, at least in part, a bowl-shaped portion that has a diameter at the first surface greater than a width of the central region at the first surface.
    Type: Application
    Filed: August 18, 2003
    Publication date: February 19, 2004
    Inventors: Shen Buswell, Deanna J. Bergstrom, Daniel Frech
  • Slotted substrate and method of making
    Publication number: 20040021742
    Abstract: The described embodiments relate to a slotted substrate for use in a fluid ejecting device. One exemplary embodiment includes a substrate having a thickness between generally opposing first and second surfaces. A slot received in the substrate. The slot has a central region joined with at least one terminal region. The central region extends between the first and second surfaces. The at least one terminal region includes, at least in part, a bowl-shaped portion that has a diameter at the first surface greater than a width of the central region at the first surface.
    Type: Application
    Filed: June 20, 2003
    Publication date: February 5, 2004
    Inventors: Shen Buswell, Deanna J. Bergstrom, Daniel Frech
  • Slotted substrate and method of making
    Patent number: 6666546
    Abstract: The described embodiments relate to a slotted substrate for use in a fluid ejecting ice. One exemplary embodiment includes a substrate having a thickness between generally opposing first and second surfaces. A slot received in the substrate. The slot has a central region joined with at least one terminal region. The central region extends between the first and second surfaces. The at least one terminal region includes, at least in part, a bowl-shaped portion that has a diameter at the first surface greater than a width of the central region at the first surface.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: December 23, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Shen Buswell, Deanna J. Bergstrom, Daniel Frech