Patents by Inventor Daniel G. Kannenberg
Daniel G. Kannenberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7880088Abstract: A bus system is disclosed for use with switching devices, such as power electronic devices. The system includes generally parallel bus elements that define electrical reference planes, such as for a dc bus. The bus elements are separated from one another by insulative layers, with additional insulative layers being available for separating the system from other circuit components. Portions of the bus elements are extended or exposed to permit connection to the circuit elements, including packaged switching circuits and energy storage or filtering circuits. The bus system may be conformed to a variety of geometric configurations, and substantially reduces parasitic inductance and total loop inductance in the resulting circuitry.Type: GrantFiled: March 3, 2008Date of Patent: February 1, 2011Assignee: Rockwell Automation Technologies, Inc.Inventors: Lawrence D. Radosevich, Steven C. Kaishian, Daniel G. Kannenberg, Timothy A. Roebke, Andreas A. Meyer, Dennis L. Kehl, Lee A. Gettelfinger
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Publication number: 20080266801Abstract: A power electronic module is cooled by a phase change heat spreader or cooling device. The module may include switched or unswitched devices, such as power transistors, diodes, and so forth, forming circuits such as rectifiers, inverters, converters, or the like, or portions of such circuits. Heat is transferred to the heat spreader in which a continuous phase change cycle takes place to cool the circuit components. The heat spreader may extend over an area sufficient to reduce the temperature of the components, and ultimately will render portions of the overall structure more isothermal.Type: ApplicationFiled: April 30, 2007Publication date: October 30, 2008Inventors: Bruce W. Weiss, Neil Gollhardt, Abdolmehdi Kaveh Ahangar, Daniel G. Kannenberg, Steven C. Kaishian
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Publication number: 20080202899Abstract: A bus system is disclosed for use with switching devices, such as power electronic devices. The system includes generally parallel bus elements that define electrical reference planes, such as for a dc bus. The bus elements are separated from one another by insulative layers, with additional insulative layers being available for separating the system from other circuit components. Portions of the bus elements are extended or exposed to permit connection to the circuit elements, including packaged switching circuits and energy storage or filtering circuits. The bus system may be conformed to a variety of geometric configurations, and substantially reduces parasitic inductance and total loop inductance in the resulting circuitry.Type: ApplicationFiled: March 3, 2008Publication date: August 28, 2008Applicant: Rockwell Automation Technologies, Inc.Inventors: Lawrence D. Radosevich, Steven C. Kaishian, Daniel G. Kannenberg, Timothy A. Roebke, Andreas A. Meyer, Dennis L. Kehl, Lee A. Gettelfinger
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Patent number: 7358442Abstract: A bus system is disclosed for use with switching devices, such as power electronic devices. The system includes generally parallel bus elements that define electrical reference planes, such as for a dc bus. The bus elements are separated from one another by insulative layers, with additional insulative layers being available for separating the system from other circuit components. Portions of the bus elements are extended or exposed to permit connection to the circuit elements, including packaged switching circuits and energy storage or filtering circuits. The bus system may be conformed to a variety of geometric configurations, and substantially reduces parasitic inductance and total loop inductance in the resulting circuitry.Type: GrantFiled: September 30, 2003Date of Patent: April 15, 2008Assignee: Rockwell Automation Technologies, Inc.Inventors: Lawrence D. Radosevich, Steven C. Kaishian, Daniel G. Kannenberg, Timothy A. Roebke, Andreas A. Meyer, Dennis L. Kehl, Lee A. Gettelfinger
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Patent number: 7212407Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 6, 2005Date of Patent: May 1, 2007Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
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Patent number: 7187548Abstract: A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 23, 2002Date of Patent: March 6, 2007Assignee: Rockwell Automation Technologies, Inc.Inventors: Andreas A. Meyer, Lawrence D. Radosevich, Bruce C. Beihoff, Dennis L. Kehl, Daniel G. Kannenberg
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Patent number: 7187568Abstract: A terminal structure for power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 23, 2002Date of Patent: March 6, 2007Assignee: Rockwell Automation Technologies, Inc.Inventors: Lawrence D. Radosevich, Daniel G. Kannenberg, Mark G. Phillips, Steven C. Kaishian
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Patent number: 7177153Abstract: An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 9, 2002Date of Patent: February 13, 2007Assignee: Rockwell Automation Technologies, Inc.Inventors: Lawrence D. Radosevich, Andreas A. Meyer, Daniel G. Kannenberg, Steven C. Kaishian, Bruce C. Beihoff
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Patent number: 7095612Abstract: A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: August 25, 2004Date of Patent: August 22, 2006Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Mark G. Phillips, Dennis L. Kehl, Steven C. Kaishian, Daniel G. Kannenberg
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Patent number: 7032695Abstract: A terminal structure for vehicle drive power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: September 23, 2002Date of Patent: April 25, 2006Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Mark G. Phillips, Dennis L. Kehl, Steven C. Kaishian, Daniel G. Kannenberg
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Patent number: 7016192Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: September 16, 2003Date of Patent: March 21, 2006Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
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Patent number: 6982873Abstract: An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 16, 2002Date of Patent: January 3, 2006Assignee: Rockwell Automation Technologies, Inc.Inventors: Andreas A. Meyer, Lawrence D. Radosevich, Bruce C. Beihoff, Dennis L. Kehl, Daniel G. Kannenberg
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Patent number: 6972957Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 18, 2002Date of Patent: December 6, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
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Patent number: 6965514Abstract: An electric vehicle drive includes a support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EM/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 23, 2002Date of Patent: November 15, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
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Patent number: 6940715Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: September 16, 2003Date of Patent: September 6, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
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Patent number: 6909607Abstract: A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 18, 2002Date of Patent: June 21, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Lawrence D. Radosevich, Daniel G. Kannenberg, Steven C. Kaishian, Bruce C. Beihoff
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Patent number: 6898072Abstract: A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 23, 2002Date of Patent: May 24, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Mark G. Phillips, Dennis L. Kehl, Steven C. Kaishian, Daniel G. Kannenberg
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Patent number: 6865080Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 23, 2002Date of Patent: March 8, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Lawrence D. Radosevich, Andreas A. Meyer, Bruce C. Beihoff, Daniel G. Kannenberg
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Publication number: 20040061989Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: September 16, 2003Publication date: April 1, 2004Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
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Publication number: 20030151893Abstract: A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: December 23, 2002Publication date: August 14, 2003Inventors: Andreas A. Meyer, Lawrence D. Radosevich, Bruce C. Beihoff, Dennis L. Kehl, Daniel G. Kannenberg