Abstract: In a reflective lithographic projection apparatus, shifts in the image of a pattern of a mask in the scanning direction caused by variations in the position of the pattern surface of the mask along the optical axis are corrected by shifting of the relative position of the mask and/or the substrate in the scanning direction. Correction of the image rotation error may also be accomplished by rotation of the relative positions of the mask and/or the substrate about the optical axis. Variations in the position of the pattern surface of the mask along the optical axis may be determined by interferometers upon installation of the mask to the lithographic projection apparatus. The variations may be mapped and stored to provide control of the lithographic projection apparatus.

Abstract: A method, system, and computer program product for non-real-time trajectory planning and real-time trajectory execution. A trajectory planning process receives data generated by high-level control software. This data defines positions and scan velocities, where multiple axis motion must be precisely synchronized. The trajectory planning process creates sequences of constant acceleration intervals that allow critical motions to be executed at maximum throughput. The output of a trajectory planning process is known as a profile. A profile executor, using the profile output by the trajectory planner process, generates continuous, synchronized, filtered, multi-axis position and acceleration commands (i.e., execution data) that drive control servos. Time intervals generated by the trajectory planner are quantized to be integer multiples of a real time clock period.

Abstract: A lithography system and method are used to increase throughput using multiple reticles to pattern multiple substrates that are positioned with respect to one another according to a predetermined sequence. For example, during a first exposure period a first reticle patterns a first set of substrates, during a second exposure period a second reticle patterns the first set of substrates and a second set of substrates, and during a third exposure period the first reticle patterns the second set of substrates, etc. This can continue with further pairs of substrates until all desired substrates are patterned. It is to be appreciated that after the first and second reticles are complete, third and fourth reticles can pattern the first and second, sets of substrates. As another example, other sequences can also be performed using four exposure periods.

Abstract: A lithography system and method are used to increase throughput using multiple reticles to pattern multiple substrates that are positioned with respect to one another according to a predetermined sequence. For example, during a first exposure period a first reticle patterns a first set of substrates, during a second exposure period a second reticle patterns a second set of substrates, during a third exposure period the first reticle patterns a third set of substrates, etc., until all desired substrates are patterned. It is to be appreciate that after the first and second reticles are complete, third and fourth reticles can pattern the first, second, third, etc. sets of substrates.

Abstract: A method, system, and computer program product for non-real-time trajectory planning and real-time trajectory execution. A trajectory planning process receives data generated by high-level control software. This data defines positions and scan velocities, where multiple axis motion must be precisely synchronized. The trajectory planning process creates sequences of constant acceleration intervals that allow critical motions to be executed at maximum throughput. The output of a trajectory planning process is known as a profile. A profile executor, using the profile output by the trajectory planner process, generates continuous, synchronized, filtered, multi-axis position and acceleration commands (i.e., execution data) that drive control servos. Time intervals generated by the trajectory planner are quantized to be integer multiples of a real time clock period.

Abstract: This invention is directed to electro-magnetic alignment apparatus, which is particularly adapted, among many other possible uses, for use in aligning the wafers in a microlithography system, said apparatus including in combination at least three magnet assemblies which are mounted in space relationship one with respect to the others, at least three coil assemblies mounted to pass through the high flux region of the magnet assemblies respectively, the width of the coil assemblies being substantially less than the width of the high flux regions respectively, a controller for controlling the flow of current through the coil assemblies respectively, a structural assembly for connecting the coil assemblies which is movable with respect to the magnet assemblies, the coil assemblies being wound with respect to each other so that by controlling the supply of current to the coils the structure assembly can be moved selectively in three degrees of freedom.

Abstract: This invention is directed to electromagnetic alignment apparatus, which is particularly adapted, among many other possible uses, for use in aligning the wafers in a microlithography system, said apparatus comprising in combination three or more spaced magnets, three or more coil assemblies mounted to pass through the magnetic fields of the magnets respectively, means for controlling the flow of current through the coil assemblies respectively, said coil assemblies being joined together to form a structure movable with respect to the magnets and adapted to carry an object thereon, the coil assemblies being wound with respect to each other so that by controlling the supply of current to the coils the structure can be moved selectively in three degrees of freedom.