Abstract: In an embodiment a sensor arrangement includes at least one sensor element, a ceramic housing, wherein the sensor element is at least partially arranged in the ceramic housing, a basic body at least partially surrounding the ceramic housing, an outer housing connected to the basic body, wherein the outer housing at least partially envelops the basic body and the ceramic housing and at least one mounting element configured for mounting the sensor arrangement to a target application, wherein the ceramic housing is configured to be in direct mechanical contact with a surface, and wherein the sensor arrangement is configured to measure a temperature of the surface.

Abstract: A measuring assembly for measuring a temperature of a test body is provided, wherein at least two separate wires suitable for thermal conduction are led away from a test body and combined into a wire bundle at a distance from the test body, and wherein a temperature sensor is attached to the wire bundle by clamping action by means of a holder. Preferably, the holder comprises a holder base having an inner side and an outer side, and spring clips connected thereto, wherein a recess for receiving a temperature sensor is arranged on the inner side of the holder base, and wherein two of the spring clips are arranged opposite each other with respect to the holder base and are adapted to generate a clamping force towards the inner side of the holder base.