Abstract: An electronic board including an area forming a BGA type electronic component backing, and an electric heating resistor which supplies an amount of heat for soldering the component onto the plate is disclosed. The board includes a plurality of conductive layers alternating with electrically insulating layers, the resistor forming one of the conductive layers immediately underlying the surface layer. The board may also include a thermal drain. A facility for implementing the method is also disclosed. It allows for an electronic board to be repaired through replacing defective members without risking to unsolder or to damage adjacent members.

Abstract: This invention is related to an electronic board comprising an area forming a BGA type electronic component backing, an electric heating resistor at right angle to said area, said resistor being able to supply an amount of heat for soldering the component onto the plate, characterized in that the board comprises a plurality of conductive layers alternating with electrically insulating layers, said resistor forming one of the conductive layers immediately underlying the surface layer. The board comprises, if need be, a thermal drain. This invention is also related to a facility for implementing the method. It also allows for an electronic board to be repaired through replacing defective members without risking to unsolder or to damage adjacent members.