Abstract: A method for measuring a profile of a manikin. The method comprises the steps of: suspending the manikin by a suspension frame, connecting one or more measuring devices to the manikin at one or more measuring points, raising a support surface to meet the manikin, supporting the manikin by the support surface, and measuring by the one or more measuring devices, differences in angles of the manikin profile between the suspended configuration of the manikin and the supported configuration of the manikin. The manikin comprises one or more articulating joints defining a manikin profile. The manikin also defines a suspended configuration when suspended by the suspension frame, and a supported configuration when supported by the support surface. The method provides a process to replicate and measure human physiology when engaged with a surface.

Abstract: An adjustable resistance hinge system for a joint connecting at least a first articulating member and a second articulating member, the hinge system comprising a central element defining a hinge axis. The central element comprises a first and a second elongate arm, each elongate arm extending away from the hinge axis, and a first and a second keeping element hinging on the hinge axis are attached to the first and the second articulating members, respectively. A first and a second biasing device are also engageable with the first and the second elongate arms, respectively. The first and the second elongate arms extend into the first and the second articulating members, respectively, and the first and the second biasing devices engage the central element to resist relative motion of the first and the second articulating members about the hinge axis. The adjustable resistance hinge system allows two joined members to be adjusted to replicate desired physiology, limits, and resistance.

Abstract: An electronic assembly has a host wafer having a first circuit including wafer transistors and passive, non-transistor devices. Chiplets have a second circuit including at least one radio frequency (RF) transistor device. Electrical interconnects are between the chiplets and wafer. The electrical interconnects electrically connect the first circuit to the second circuits. Oscillators that have the wafer transistor, the RF transistor and the electrical interconnects produce a signal for built-in self-test circuits for testing an assembly design of the electronic assembly and speeds of the RF chiplet transistors.

Abstract: A system for measuring spinal and/or skeletal angles of a manikin in a lateral position. The system comprises a manikin, the manikin comprising one or more articulating joints and a spinal and/or skeletal profile defining a manikin profile, a suspension frame, the suspension frame suspending the manikin, one or more measuring devices connected to the manikin at one or more measuring points, and a support surface, the support surface adjustable in at least a vertical axis. The manikin comprises a suspended configuration when suspended by the suspension frame, and a supported configuration when supported by the support surface. The one or more measuring devices measures differences in the spinal and/or skeletal angles of the manikin profile between the suspended configuration and the supported configuration. The invention provides a system to replicate and measure human physiology when engaged with a surface.

Abstract: The disclosure relates to assemblies of thin-walled tubes and mandrels for use in thin wall catheter liners. For example, an assembly is provided that includes a thin-walled PTFE tube comprising walls with a thickness of less than 0.004 inches, positioned over a filled mandrel comprising PTFE with one or more fillers incorporated therein. The disclosure further provides, independently, thin-walled tubes and filled mandrels, as well as methods of making and using such components.

Abstract: An electronic assembly has a wafer having a first circuit including passive devices for the purpose of one of tuning or matching networks. Chiplets are placed in the cavities. At least one chiplet has a second circuit including at least one transistor or switch device and passive tuning circuits including at least one of a stabilization network, a gain boosting network, a power delivery network, or a low-noise network. Electrical interconnects between the chiplets and wafer electrically connect the first circuitry to the second circuitry.

Abstract: A system for instructing a user on repairing a vehicle configured to (i) receive, from the user computing device, a request to repair a vehicle, the vehicle including a damaged portion, (ii) prompt the user by displaying a prompt on a user interface of the user computing device to transmit one or more images of the damaged portion of the vehicle; (iii) execute a machine learning model by inputting the one or more images of the damaged portion of the vehicle, the machine learning model configured to determine damage to the vehicle based on at least the one or more images of the vehicle and to determine one or more repair facilities capable of performing repairs to the damage to the vehicle; and (iv) cause the one or more repair facilities to be displayed on the user computing device.

Abstract: Systems and methods for network-based cloud service platform integrations with dealer management systems (DMS) are disclosed herein. A cloud service platform may integrate over the network with an instance of a DMS used by an end user. The cloud service platform may define fields that can be used in conjunction with forms useable with the DMS, and may be further capable of storing field data for those fields. The cloud service platform may provide a graphical user interface (GUI) prompt to a user of the DMS to provide the field data. A form using the fields defined at the cloud service platform may be provided to the cloud service platform and filled at the cloud service platform using field data for those fields stored at the cloud service platform. The form may then be provided to a print service for presentation to the user.

Abstract: A system for instructing a user on repairing a vehicle configured to (i) receive, from the user, a request to repair a vehicle, including information about the vehicle; (ii) present, to the user via a user computer device, a user interface to allow the user to search for a repair facility to repair the vehicle; (iii) receive, from the user via the user interface, a selection of a repair facility; (iv) determine whether the selected repair facility is a select service location, where a select service location is a pre-authorized repair facility; and (v) if the selected repair facility is a select service location, transfer the information about the vehicle to a computer device associated with the selected repair facility.

Abstract: An electronic assembly has a host wafer having a first circuit including passive devices for the purpose of one of tuning or matching networks. Chiplets are placed in the cavities. At least one chiplet has a second circuit including at least one transistor or switch device and passive tuning circuits including at least one of a stabilization network, a gain boosting network, a power delivery network, or a low-noise network. Electrical interconnects between the chiplets and wafer electrically connect the first circuitry to the second circuitry.

Abstract: Systems and methods for network-based cloud service platform integrations with dealer management systems (DMS) are disclosed herein. A cloud service platform may integrate over the network with an instance of a DMS used by an end user. The cloud service platform may define fields that can be used in conjunction with forms useable with the DMS, and may be further capable of storing field data for those fields. The cloud service platform may provide a graphical user interface (GUI) prompt to a user of the DMS to provide the field data. A form using the fields defined at the cloud service platform may be provided to the cloud service platform and filled at the cloud service platform using field data for those fields stored at the cloud service platform. The form may then be provided to a print service for presentation to the user.

Abstract: The disclosure relates to assemblies of thin-walled tubes and mandrels for use in thin wall catheter liners. For example, an assembly is provided that includes a thin-walled PTFE tube comprising walls with a thickness of less than 0.004 inches, positioned over a filled mandrel comprising PTFE with one or more fillers incorporated therein. The disclosure further provides, independently, thin-walled tubes and filled mandrels, as well as methods of making and using such components.

Abstract: The disclosure generally relates to ultra high molecular weight poly (ethylene) (“UHMWPE”) tubes with an average wall thickness of 0.2 mm or less; a tensile stress at break greater than 40 MPa; and a storage modulus of greater than 500 MPa at 23° C. The disclosure further relates to preparing and using such tubes and to constructions (e.g., catheter constructions) and components thereof including such tubes.

Abstract: A system for measuring spinal and/or skeletal angles of a manikin in a lateral position. The system comprises a manikin, the manikin comprising one or more articulating joints and a spinal and/or skeletal profile defining a manikin profile, a suspension frame, the suspension frame suspending the manikin, one or more measuring devices connected to the manikin at one or more measuring points, and a support surface, the support surface adjustable in at least a vertical axis. The manikin comprises a suspended configuration when suspended by the suspension frame, and a supported configuration when supported by the support surface. The one or more measuring devices measures differences in the spinal and/or skeletal angles of the manikin profile between the suspended configuration and the supported configuration. The invention provides a system to replicate and measure human physiology when engaged with a surface.

Abstract: A variable masking scheme for attenuating undesired optical artifact (26, 28, 30, 32) appearing in overlap regions (20, 22) between adjacent projection tiles (12, 14, 16) of a multi-projector (1, 2, 3) projection system (10). Different portions (54, 60) of a projection beam (43) are blocked by a mask apparatus (34) in response to a value (66) of a variable associated with a projected scene in order to attenuate respective artifacts correlated with that variable. The variable may be an optical parameter such as brightness (e.g., for a nighttime scene versus a dawn scene) or color, and the artifacts may be bright spots or shadows. The variable masking scheme may involve moving a single mask (36) to multiple positions or using multiple alternative masks (50, 56) in response to the variable.

Abstract: An electronic assembly has a host wafer having a first circuit including passive devices for the purpose of one of tuning or matching networks. Chiplets are placed in the cavities. At least one chiplet has a second circuit including at least one transistor or switch device and passive tuning circuits including at least one of a stabilization network, a gain boosting network, a power delivery network, or a low-noise network. Electrical interconnects between the chiplets and wafer electrically connect the first circuitry to the second circuitry.

Abstract: The disclosure relates to assemblies of thin-walled tubes and mandrels for use in thin wall catheter liners. For example, an assembly is provided that includes a thin-walled PTFE tube comprising walls with a thickness of less than 0.004 inches, positioned over a filled mandrel comprising PTFE with one or more fillers incorporated therein. The disclosure further provides, independently, thin-walled tubes and filled mandrels, as well as methods of making and using such components.

Abstract: A method for measuring a profile of a manikin. The method comprises the steps of: suspending the manikin by a suspension frame, connecting one or more measuring devices to the manikin at one or more measuring points, raising a support surface to meet the manikin, supporting the manikin by the support surface, and measuring by the one or more measuring devices, differences in angles of the manikin profile between the suspended configuration of the manikin and the supported configuration of the manikin. The manikin comprises one or more articulating joints defining a manikin profile. The manikin also defines a suspended configuration when suspended by the suspension frame, and a supported configuration when supported by the support surface. The method provides a process to replicate and measure human physiology when engaged with a surface.

Abstract: Flooring and sheet material having an extruded core that is mechanically embossed and directly printed with a desired décor image. One or more scratch resistant and UV resistant coatings can be applied thereafter. In one example, the embossing is performed directly after the core is extruded and cooling down, releasing heat generated during the extrusion thereof. An embossed roller, an embossed press plate or the like can be provided to permanently impress an emboss pattern in the core.

Abstract: An electronic assembly has a host wafer having a first circuit including wafer transistors and passive, non-transistor devices. Chiplets have a second circuit including at least one radio frequency (RF) transistor device. Electrical interconnects are between the chiplets and wafer. The electrical interconnects electrically connect the first circuit to the second circuits. Oscillators that have the wafer transistor, the RF transistor and the electrical interconnects produce a signal for built-in self-test circuits for testing an assembly design of the electronic assembly and speeds of the RF chiplet transistors.