Patents by Inventor Daniel Grodensky

Daniel Grodensky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240151836
    Abstract: Disclosed herein are methods, systems, and devices that relate to light detection and ranging (LIDAR). A controlling means for a LIDAR system includes a means for determining a current operational state of the LIDAR system regarding a predefined threshold state. The controlling means also switches the LIDAR system from a first operational mode to a second operational mode when the determined operational state exceeds the predefined threshold state. The second operational mode corresponds to an operational power of at least one operational means of the LIDAR system being lower than in the first operational mode.
    Type: Application
    Filed: March 18, 2022
    Publication date: May 9, 2024
    Inventors: Liron AIN-KEDEM, Avi MEDLINSKY, Daniel GRODENSKY, Shachar GREENBERG
  • Publication number: 20230318247
    Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to a package that includes multiple PICs in the package that are optically coupled with each other. In embodiments, the package may include discrete electronic and optical components, and thermal management solutions for co-packaging of multiple PICs. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 5, 2023
    Inventors: Eleanor Patricia Paras RABADAM, Guiyun BAI, Sanjeev GUPTA, Ronald SPREITZER, Jonathan DOYLEND, Ankur AGRAWAL, Boping XIE, Sushrutha Reddy GUJJULA, Jason GARCIA, Kenneth BROWN, Dan WANG, Daniel GRODENSKY, Israel PETRONIUS, Konstantin MATYUCH
  • Publication number: 20220404474
    Abstract: Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.
    Type: Application
    Filed: December 21, 2021
    Publication date: December 22, 2022
    Inventors: Eleanor Patricia Paras Rabadam, Guiyun Bai, Israel Petronius, Sushrutha Gujjula, Ronald L. Spreitzer, Kenneth Brown, Konstantin Matyuch, Boping Xie, Stephen Keele, Qifeng Wu, Ankur Agrawal, Jonathan Doylend, Sanjeev Gupta, Sam Khalili, Daniel Grodensky, Nan Kong Ng, Ron Friedman, Gal Dvoretzki
  • Publication number: 20220390562
    Abstract: Disclosed herein are microelectronics packages and methods for manufacturing the same. The microelectronics packages may include a photonic integrated circuit (PIC), an electrical integrated circuit (EIC), and an interconnect. The interconnect may connect the EIC to the PIC. The interconnect may include a plurality of paths between the EIC and the PIC and the individual paths of the plurality of paths are less than 100 micrometers long.
    Type: Application
    Filed: December 21, 2021
    Publication date: December 8, 2022
    Inventors: Guiyun Bai, Sushrutha Gujjula, Ronald L. Spreitzer, Naresh Satyan, David Mathine, Sam Khalili, Sanjeev Gupta, Eleanor Patricia Paras Rabadam, Ankur Agrawal, Kenneth Brown, Jonathan Doylend, Daniel Grodensky, Israel Petronius
  • Publication number: 20220342078
    Abstract: A photonic integrated circuit, comprising a semiconductor photonic substrate having integrated therein: at least one light receiving input; at least one optical splitter to branch light received at the at least one light receiving input to a first light path and a second light path; wherein, the photonic integrated circuit, in the first light path, includes: at least one first amplifier structure to amplify the light in the first light path to provide first amplified light; at least one first light output to output the first amplified light from the at least one first amplifier structure; and at least one first photo detector to receive light from the outside of the photonic integrated circuit, the at least one first photo detector being located next to the at least one first light output; wherein, the photonic integrated circuit, in the second light path, includes: at least one second amplifier structure to amplify the light in the second light path to provide second amplified light; at least one second ligh
    Type: Application
    Filed: September 25, 2020
    Publication date: October 27, 2022
    Inventors: George RAKULJIC, Naresh SATYAN, Yaakov VILENCHIK, Ron FRIEDMAN, Daniel GRODENSKY, Israel PETRONIUS, Amnon YARIV
  • Patent number: 10281322
    Abstract: An optical circuit includes solid state photonics. The optical circuit includes a phased array of solid state waveguides that perform beamsteering on an optical signal. The optical circuit includes a modulator to modulate a bit sequence onto the carrier frequency of the optical signal, and the beamsteered signal includes the modulated bit sequence. The optical circuit includes a photodetector to detect a reflection of the beamsteered optical signal. The optical circuit autocorrelates the reflection signal with the bit sequence to generate a processed signal.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: May 7, 2019
    Assignee: Intel Corporation
    Inventors: Jonathan K. Doylend, David N. Hutchison, John Heck, Haisheng Rong, Daniel Grodensky, David Arbel, Israel Petronius
  • Publication number: 20180156661
    Abstract: An optical circuit includes solid state photonics. The optical circuit includes a phased array of solid state waveguides that perform beamsteering on an optical signal. The optical circuit includes a modulator to modulate a bit sequence onto the carrier frequency of the optical signal, and the beamsteered signal includes the modulated bit sequence. The optical circuit includes a photodetector to detect a reflection of the beamsteered optical signal. The optical circuit autocorrelates the reflection signal with the bit sequence to generate a processed signal.
    Type: Application
    Filed: October 17, 2017
    Publication date: June 7, 2018
    Inventors: Jonathan K. DOYLEND, David N. HUTCHISON, John HECK, Haisheng RONG, Daniel GRODENSKY, David ARBEL, Israel PETRONIUS
  • Patent number: 9823118
    Abstract: An optical circuit includes solid state photonics. The optical circuit includes a phased array of solid state waveguides that perform beamsteering on an optical signal. The optical circuit includes a modulator to modulate a bit sequence onto the carrier frequency of the optical signal, and the beamsteered signal includes the modulated bit sequence. The optical circuit includes a photodetector to detect a reflection of the beamsteered optical signal. The optical circuit autocorrelates the reflection signal with the bit sequence to generate a processed signal.
    Type: Grant
    Filed: December 26, 2015
    Date of Patent: November 21, 2017
    Assignee: Intel Corporation
    Inventors: Jonathan K Doylend, David N Hutchison, John Heck, Haisheng Rong, Daniel Grodensky, David Arbel, Israel Petronius
  • Publication number: 20170288067
    Abstract: Techniques for shielding an optical sensor are described. An example of an electronic device includes an optical sensor and a combined light-focusing and electrical-shielding unit disposed over the optical sensor. The light-focusing and electrical-shielding unit has two portions. The first portion gathers light and focuses the light on the electrical sensor. The second portion encloses sides of the first portion and is coated with an electrically conductive material to shield the optical sensor from electromagnetic interference.
    Type: Application
    Filed: March 30, 2016
    Publication date: October 5, 2017
    Applicant: Intel Corporation
    Inventors: Arnon Hirshberg, Barak Freedman, Daniel Grodensky
  • Publication number: 20170184450
    Abstract: An optical circuit includes solid state photonics. The optical circuit includes a phased array of solid state waveguides that perform beamsteering on an optical signal. The optical circuit includes a modulator to modulate a bit sequence onto the carrier frequency of the optical signal, and the beamsteered signal includes the modulated bit sequence. The optical circuit includes a photodetector to detect a reflection of the beamsteered optical signal. The optical circuit autocorrelates the reflection signal with the bit sequence to generate a processed signal.
    Type: Application
    Filed: December 26, 2015
    Publication date: June 29, 2017
    Inventors: Jonathan K. Doylend, David N. Hutchison, John Heck, Haisheng Rong, Daniel Grodensky, David Arbel, Israel Petronius