Abstract: A papermaking apparatus such as a Fourdrinier table which includes a long blade and a trail blade. In the first aspect of the invention, the long blade includes an upper undulated surface with vents passing from the upper undulated surface to the lower surface of the long blade which is at substantially atmospheric pressure. In the second aspect of the invention, the trail blade includes an elevator-type device for adjusting the vertical position of the trail blade. In a third aspect of the invention, a single elevator is used to adjust the angle of the blade, the blade is provided as a modular or multiple-piece design, mounting buttons are used to engage slots of T-shaped cross section in the blade and/or ceramic inserts are included at wear points.

Abstract: A papermaking apparatus such as a Fourdrinier table which includes a long blade and a trail blade. In the first aspect of the invention, the long blade includes an upper undulated surface with vents passing from the upper undulated surface to the lower surface of the long blade which is at substantially atmospheric pressure. In the second aspect of the invention, the trail blade includes an elevator-type device for adjusting the vertical position of the trail blade. In a third aspect of the invention, a single elevator is used to adjust the angle of the blade, the blade is provided as a modular or multiple-piece design, mounting buttons are used to engage slots of T-shaped cross section in the blade and/or ceramic inserts are included at wear points.

Abstract: A papermaking apparatus such as a Fourdrinier table which includes a long blade and a trail blade. In the first aspect of the invention, the long blade includes an upper undulated surface with vents passing from the upper undulated surface to the lower surface of the long blade which is at substantially atmospheric pressure. In the second aspect of the invention, the trail blade includes an elevator-type device for adjusting the vertical position of the trail blade. The first and second aspects may be used independently or simultaneously.

Abstract: A process for two layer gold integrated circuit metallization is disclosed. The process includes electrodeposition of a first metal layer, preferably of gold, atop a barrier layer, followed by electrodeposition of a second metal layer or cap, atop the gold to form a first metallization layer. The cap is corrosion-resistant metal having a rigidity at annealing temperature greater than that of gold. Following annealing, a dielectric interlayer is deposited so as to fill the regions adjacent sidewalls of the first metallization layer. Vias are formed in the interlayer dielectric, a second barrier layer is deposited and photoresist is applied and patterned for electrodeposition of a second, gold metallization layer. During annealing, the rhodium cap retains the as-deposited shape of the gold in the first metallization layer to facilitate insulative spacing between the first and second metallizations and to insure complete filling of interlayer dielectric on the lower edges of the first metallization.