Abstract: Disclosed is a method of severing a fiber length projecting out of the end face of a plurality of ferrules. The ferrules are mounted in a polishing fixture. Image processing establishes the fiber cleaving plane. Relative movement between the laser beam and the ferrule severs the fiber protruding out of the ferrule end-face. Excess epoxy that may be present on the ferrule end-face is removed concurrently with the fiber severing process. The method includes cleaning and inspection of ferrules.

Abstract: Disclosed is a one step fiber optic connector polishing method. The method is a sequence of processes that may include severing a fiber (100) length projecting out of the end face (106) of a ferrule (102) having a pre-shaped surface, such that the residual fiber length does not exceed 80 microns. Cleaning ferrule (102) end face (106) such that no residual debris are left on it. Polishing fiber end-face (140) only, on a finishing polishing film (180) until fiber end-face (140) and ferrule end-face (106) are in a relation that ensures the desired fiber undercut or protrusion.

Abstract: Disclosed is a one step fiber optic connector polishing method. The method is a sequence of processes that may include severing a fiber (100) length projecting out of the end face (106) of a ferrule (102) having a pre-shaped surface, such that the residual fiber length does not exceed 80 microns. Cleaning ferrule (102) end face (106) such that no residual debris are left on it. Polishing fiber end-face (140) only, on a finishing polishing film (180) until fiber end-face (140) and ferrule end-face (106) are in a relation that ensures the desired fiber undercut or protrusion.

Abstract: A method for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one embodiment, a method for delivering a polishing fluid to a polishing surface of a chemical mechanical polisher includes flowing polishing fluid to a first portion of the polishing surface through a first outlet while a second portion of the polishing surface adjacent a second outlet receives no flow of polishing fluid, and flowing polishing fluid through the second outlet to the second portion of the polishing surface.

Abstract: A method and apparatus for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one embodiment, an apparatus for delivering a polishing fluid to a chemical mechanical polishing surface includes an arm having a plurality of holes formed in the arm for retaining a plurality of polishing fluid delivery tubes. Each of the tubes are disposed through one of the holes and coupled to the arm. The number of holes exceeds the number of tubes, thereby allowing the distribution of polishing fluid to a polishing surface and correspondingly the local polishing rates across a diameter of a substrate being polished to be controlled.

Abstract: A method and apparatus for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one embodiment, an apparatus for delivering a polishing fluid to a chemical mechanical polishing surface includes an arm having a plurality of holes formed in the arm for retaining a plurality of polishing fluid delivery tubes. Each of the tubes are disposed through one of the holes and coupled to the arm. The number of holes exceeds the number of tubes, thereby allowing the distribution of polishing fluid to a polishing surface and correspondingly the local polishing rates across a diameter of a substrate being polished to be controlled.

Abstract: A method of mapping areas of a slide includes the steps of selectively illuminating the slide from a first light source oriented generally obliquely to the surface of the slide, obtaining a first image of the slide illuminated by the first light source, selectively illuminated the slide from a second light source providing generally scattered light, obtaining an image of said second image illuminated by the second light source, and generating a map of areas of significance based on the first and second images.