Patents by Inventor Daniel Hodgkins

Daniel Hodgkins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160268034
    Abstract: A planar magnetic component includes a printed circuit board, a coil formed on one or more electrically conductive metal layers of the printed circuit board, terminals electrically connected to the coil for energizing the coil, and a magnetic core mounted to the printed circuit board for confining magnetic flux of the coil. The printed circuit board defines an alignment feature for engaging with a mating feature on a mating circuit board, thereby to align the planar magnetic component with the mating circuit board.
    Type: Application
    Filed: March 13, 2015
    Publication date: September 15, 2016
    Applicant: BOSE CORPORATION
    Inventors: Bradford Kyle Subat, Remco Terwal, Daniel Hodgkins
  • Patent number: 8861209
    Abstract: In an aspect, in general, an apparatus includes an electrically conductive housing including a first portion and second portion, the first portion including electronic circuitry. An electromagnetic shield separates the first portion and the second portion and is configured to electromagnetically isolate the electronic circuitry of the first portion from the second portion. The electromagnetic shield includes a plurality of electrically conductive walls partially separating the first portion and the second portion, a plurality of electrically conductive spring loaded fingers extending from an end of at least one of the plurality of electrically conductive walls and configured to contact an inner surface of the housing. Together, the plurality of electrically conductive walls and the plurality of electrically conductive spring loaded fingers separate the first portion and the second portion.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: October 14, 2014
    Assignee: Bose Corporation
    Inventors: Brad Subat, Daniel Hodgkins
  • Patent number: 8837768
    Abstract: An apparatus that has an electro-acoustic transducer, a frame supporting the transducer, and an enclosure made from two enclosure members that are each coupled to the frame. At least one of the enclosure members is made partially or entirely of foam.
    Type: Grant
    Filed: March 28, 2011
    Date of Patent: September 16, 2014
    Assignee: Bose Corporation
    Inventors: Brad Subat, Daniel Hodgkins, David Meeker, Daniel J. Sheehan, Martin A. Weber
  • Publication number: 20140218876
    Abstract: In an aspect, in general, an apparatus includes an electrically conductive housing including a first portion and second portion, the first portion including electronic circuitry. An electromagnetic shield separates the first portion and the second portion and is configured to electromagnetically isolate the electronic circuitry of the first portion from the second portion. The electromagnetic shield includes a plurality of electrically conductive walls partially separating the first portion and the second portion, a plurality of electrically conductive spring loaded fingers extending from an end of at least one of the plurality of electrically conductive walls and configured to contact an inner surface of the housing. Together, the plurality of electrically conductive walls and the plurality of electrically conductive spring loaded fingers separate the first portion and the second portion.
    Type: Application
    Filed: February 1, 2013
    Publication date: August 7, 2014
    Inventors: Brad Subat, Daniel Hodgkins
  • Publication number: 20120250929
    Abstract: An apparatus that has an electro-acoustic transducer, a frame supporting the transducer, and an enclosure made from two enclosure members that are each coupled to the frame. At least one of the enclosure members is made partially or entirely of foam.
    Type: Application
    Filed: March 28, 2011
    Publication date: October 4, 2012
    Inventors: Brad Subat, Daniel Hodgkins, David Meeker, Daniel J. Sheehan, Martin A. Weber
  • Patent number: 6021044
    Abstract: A heatsink assembly for removing at least some of the heat produced by an electronic component during use includes a heatsink, a heatpipe mounted on the heatsink and a plurality of thin, elongated fins mounted on the heatpipe. The heatsink is an elongated, generally rectangularly-shaped body and comprises a bottom surface, a top surface and a central, cylindrical channel formed in the top surface. A pair of clip recesses are formed in the top surface of the heatsink on opposite sides of the central channel. A first set of thin, elongated fins and a second set of thin, elongated fins are also formed in the top surface of the heatsink and serve to remove at least some of the heat transferred onto the heatsink. The heatpipe comprises an evaporator section and a condenser section. The evaporator section of the heatpipe is disposed tightly within the central channel of the heatsink so as to maximize the transfer of heat from the heatsink to the heatpipe.
    Type: Grant
    Filed: August 13, 1998
    Date of Patent: February 1, 2000
    Assignee: Data General Corporation
    Inventors: Robert J. Neville, Jr., Daniel Hodgkins