Abstract: A method for grinding the surface of non-round workpieces. The method includes the steps of clamping a workpiece within a machining unit; machining the workpiece; without unclamping the workpiece, contactlessly measuring the workpiece using an optical measuring device having a conoscopic holography sensor with a characteristic measuring range; and machining and measuring the workpiece in an alternating manner to iteratively approach the desired measurements of a specified form by adjusting the distance between the optical measuring device and the surface of the workpiece depending on there being a deviation of the surface from the specified form so that a respectively measured area of the surface of the workpiece remains within the measuring range of the optical sensor.

Abstract: An apparatus and method for machining workpieces is provided, in particular, for grinding the surface of non-round workpieces. The workpiece is clamped within a machining unit and the surface of this workpiece is contactlessly measured by means of a measuring device while the workpiece is clamped within the machine.

Abstract: The device for carrying out the present method is configured as a machining unit having a device (30) measuring the outside of a workpiece in a contactless manner. Said measuring device is arranged on the machine such that it opposes the surface of the workpiece to be measured at least some times. According to the present method, the workpiece is machined while clamped into the machining unit, and the machined surface of the same is measured in a contactless manner with the measuring device, specifically while the workpiece is still clamped into the machine. This method is suited for machining workpieces, particularly for grinding the surface of non-round workpieces.