Abstract: The invention relates to an arrangement enabling a liquid (2) to flow evenly around a surface of a sample (3); said arrangement has a flow chamber (1) through which a liquid (2) flows via inflow and outflow pipes (7, 8). The sample (3) can be rotated about an axis of rotation by means of a rotary drive (5). A filter (13) which extends crosswise to the direction of flow of the liquid (2) and which ensures a uniform flow through the inflow and outflow pipes (7, 8) is situated in front of the inflow and outflow pipes (7, 8). The arrangement is especially suitable for depositing a homogeneous layer of a nickel/iron alloy on a silicon wafer (3). The invention relates furthermore to the use of the arrangement.

Abstract: The printed circuit boards (LP) are conducted through treatment baths (BB1 through BB3) in vertical attitude on at least two horizontal conveying paths (TW1 through TW4) proceeding next to one another, these treatment baths being accommodated in treatment cells (BZ10 through BZ13, BZ20 through BZ23, BZ30 through BZ33) that are arranged successively and next to one another. The end walls of the treatment cells are provided with vertical slots (S) and allocated seals (D) for the passage of the printed circuit boards. The bath liquid emerging from treatment cells arranged next to one another is collected in common collecting tanks (AW1 through AW3) and is returned into the treatment cells with the assistance of pumps (P). A common treatment cell for treatment zones lying next to one another can also be provided in a common collecting tank. The conveying of the printed circuit boards on the conveying paths lying next to one another preferably ensues with a common conveyor device.

Abstract: The plate-shaped workpieces (W) are conducted through a treatment cell (BZ) containing a treatment bath in vertical attitude on a horizontal conveying path with the assistance of contacting and conveying means, the end walls of said treatment cell having vertical slots for the passage of the workpieces (W). The bath liquid emerging from the treatment (BZ) is collected in a collecting tank and is returned such into the treatment cell (BZ) with the assistance of a pump that an at least largely vertical flow direction (SR) derives at both sides of the conveying path. The bath liquid is diverted toward the surface of the workpieces (W) with guide devices (LV) arranged at both sides of the convoying path in the treatment cell (BZ). An improved ion exchange in the region of the workpieces (W) is effected by the guide devices (LV). In, for example, the electrolytic treatment of printed circuit boards, the metal deposition can thus be undertaken with high current densities.

Abstract: The flat workpieces (W) are conveyed in the vertical position on a horizontal transport path through at least one processing cell (BZ) that contains a processing bath, vertical slots (S) for the passage of the workpieces (W) being provided in the end walls of the processing cell (BZ). Bars or rods which are arranged in pairs in the processing bath, such that they are loose in the vertical direction, are assigned in pairs to the slots (S) as seals (D) and are pressed by the liquid pressure against one another or against the workpiece (W) respectively passing through, and against the assigned end wall of the processing cell (BZ). Seals (D) having a circuilar cylindrical cross section rotate while the workpieces (W) are passing through. The seals (D) are preferably arranged in end chambers (SK) which are fitted at the ends to the processing cells.

Abstract: For the electrophoretic application of a lacquer onto plate-shaped work pieces, the work pieces are conveyed on a horizontal throughput path through a cell wherein a lacquer deposition bath and at least one electrode are situated. The anodic or cathodic contacting of the traversing work pieces occurs via an endlessly circulating contacting drive preferably formed by a metal band and via a contact element arranged outside the cell for the feed of the anode current or cathode current to the contacting drive. The lacquer deposited on the contacting drive in the cell is in turn removed via a cleaning arrangement outside the cell and, thus, a reliable contacting of the work pieces is guaranteed. The apparatus is particularly suitable for the electrophoretic application of etching resists, plating resists and solder resists onto printed circuit boards.

Abstract: An electroplating apparatus having a plurality of upper electrolyte feeder elements and upper electrolyte discharge elements aligned transversely relative to a throughput path of the printed circuit boards and arranged in alternation above the throughput path, a plurality of lower electrolyte feeder elements and lower electrolyte discharge elements aligned transversely relative to the throughput path and arranged in alternation under the throughput path, wherein each lower electrolyte discharge element is positioned opposite an upper electrolyte feeder element and each upper electrolyte discharge elements is positioned opposite a lower electrolyte feeder element, and wherein vertical and horizontal flow components of the electrolyte solution result and their direction alternatingly changes as seen along the throughput path of the printed circuit boards.

Abstract: An electroplating device for sheet-like circuit boards characterized by an upper and lower electrode extending on opposite sides of a path for the boards, electrolyte headers being arranged adjacent the inlet and the outlet of the apparatus above and below the path for the boards and wash jets being arranged above the path for discharging electrolyte solution vertically against the boards as they pass therethrough.

Abstract: An electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards which are guided through an electrolytic solution in a horizontal path for the application of metal has a conveying arrangement comprising laterally arranged upper band drives and laterally arranged lower band drives whereby the workpieces are entrained in a friction-actuated fashion between a lower run of the upper band drive and an upper run of the lower band drive. In addition, a sealing wall is arranged between the upper and lower runs of each of the band drives to produce a sealing arrangement for a laterally exposed edge of the workpiece, which is engaged by a contacting mechanism for the cathodic contacting of the workpiece projecting through the band drives.

Abstract: An improvement in an electroplating apparatus which has a conveyor arrangement which conveys a workpiece through an electrolyte bath with an edge portion of each of the workpieces extending laterally out of the bath in a sealed relationship and being engaged by a contact arrangement characterized by the contact arrangement being constructed as an endlessly moving belt having either brushes or contact spring pairs for engaging the edge of the workpiece. In addition, the belt is arranged to move over two pulleys to provide a run adjacent the edge and a return run which passes through a cleaning arrangement which is an electrolytic demetallization cell.

Abstract: An electroplating apparatus for plate-shaped workpieces which are conveyed in a horizontal path through an electrolytic cell characterized by the edges of the workpieces being grasped via contact elements that are secured on an endless circular flexible metal band. The side face of the metal band facing toward the workpiece glides above and below the conveyor and contact elements on guide and seal elements that extend in the wall of the cell along the horizontal direction. The metal band and conveyor and contact elements simultaneously have the job of conveying the workpiece, of cathodic contacting of the workpiece and of sealing an electroplating cell against the emergence of electrolyte solution.

Abstract: An electroplating apparatus, which has the workpieces, such as printed circuit boards, being conducted through an electrolyte solution in a horizontal path, has cathodic contacting by contact clamps, which move with the workpiece through the device. In order to guarantee a reliable supply of cathode current with a low thermal heating and a low wear of the contacts, which are also simultaneously resistant to the corrosion of the conducting parts, a live rail is provided that comprises a core composed of a material of high electrical conductivity, such as copper, and is covered by an envelope composed of a material having a high resistance to corrosion, such as titanium. Contact springs, preferably composed of titanium, are connected to the live rail in a mechanical and electrical conductive fashion, such as by spot welding, and engage each of the contact clamps as they move along the path.

Abstract: An electroplating apparatus for plating plate-shaped workpieces, particularly printed circuit boards, as they move in a horizontal path through a tank of electrolyte between an upper anode and a lower anode characterized by the device including four electrolyte headers arranged with a pair at the input of the path between the upper and lower anodes, and a pair at the end of the path between the upper and lower anodes, with each pair having one header disposed above the path and one header disposed below the path. Each of the headers as a plurality of openings extending at an attack angle to the horizontal path to create both horizontal and vertical components for a flow of the electrolyte between the surfaces of the workpieces and each of the upper and lower anodes.

Abstract: A treatment facility, which has a continuous circulation of a treatment fluid between a supply reservoir and a treatment cell, characterized by an arrangement to prevent frothing and/or foaming of the treatment fluid being returned to the reservoir. The arrangement includes a distributor having an exit slot which is positioned in the reservoir with the exit slot being above the level of the fluid in the reservoir.

Abstract: An apparatus for electroplating plate-shaped workpieces, such as a printed circuit board, having a cell, an arrangement for conducting the workpiece through the cell, and anodes arranged in the cell in contact with the electrolyte solution characterized by an arrangement to cathodically connect the workpiece including at least one tong-shaped contact clamp for gripping the workpiece and arrangement for moving the clamp along with the workpiece, as is conveyed through the cell. Preferably, the arrangement for moving is an endless drive of a continuous member, such as a chain or a plurality of belts, and a plurality of contact clamps are spaced along this member to grip the edge portion of the workpieces.

Abstract: A device for electroplating portions of a continuously moving, cathodically connecting workpiece as it is moved past a plurality of anodically connected spray nozzles characterized by the spray nozzles comprising precious metal and being positioned one after another in a row along the direction of movement of the workpiece with each of the nozzles having an individual stream of electrolytes emerging unimpeded therefrom. The continuously moving workpiece is positioned so that selected portions thereof are moved along the row of nozzles to be contacted by the stream of electrolyte emerging from the individual nozzles for a free and unimpeded electroplating of the portions contacted by the streams.

Abstract: An electrolysis device for electrolytic deposition of a metal on at least one surface of the tape which has been precoated with a metal provides an electrolytic metal deposition band in which there is a first electrode for connection to a first voltage source. A tape drive is provided for moving the tape through the bath including first guide rollers defining a single loop for the tape through the bath. A second electrode is provided in the tape path and mounted to contact the tape above the entrance to the bath and over an area of the one metallized surface and is connected to a second source potential. Second guide rollers along the tape path downstream of the bath, including a second guide roller contact the metallized surface and is connected to a third source potential.