Abstract: Examples disclosed herein relate to dual in-line memory module (DIMM) battery backup. Some examples disclosed herein describe systems that include a backup power source pluggable into a DIMM slot. The backup power source may include a plurality of battery cells electrically connected to a DIMM to provide backup power to the DIMM. Each of the plurality of battery cells supporting the DIMM may be electrically connected to a DC-to-DC converter in series and to each other in parallel.

Abstract: Techniques for providing an uninterruptible power supply are disclosed. An example system includes three single-phase Uninterruptible Power Supplies (UPSs) and an adapter. The adapter is to receive three-phase AC power, and separate the three-phase AC power into three separate single-phase outputs. Each single-phase output is coupled to an input of one of the three single-phase UPSs. An output of each one of the single-phase UPSs is coupled to one of three single-phase inputs of the adapter, and the adapter is to combine the three single-phase inputs into a single three-phase output.

Abstract: Examples disclosed herein relate to dual in-line memory module (DIMM) battery backup. Some examples disclosed herein describe systems that include a backup power source pluggable into a DIMM slot. The backup power source may include a plurality of battery cells electrically connected to a DIMM to provide backup power to the DIMM. Each of the plurality of battery cells supporting the DIMM may be electrically connected to a DC-to-DC converter in series and to each other in parallel.

Abstract: Examples disclosed herein relate to dual in-line memory module (DIMM) battery backup. Some examples disclosed herein describe systems that include a backup power source pluggable into a DIMM slot. The backup power source may include a plurality of battery cells electrically connected to a DIMM to provide backup power to the DIMM. Each of the plurality of battery cells supporting the DIMM may be electrically connected to a DC-to-DC converter in series and to each other in parallel.

Abstract: Techniques for providing an uninterruptible power supply are disclosed. An example system includes three single-phase Uninterruptible Power Supplies (UPSs) and an adapter. The adapter is to receive three-phase AC power, and separate the three-phase AC power into three separate single-phase outputs. Each single-phase output is coupled to an input of one of the three single-phase UPSs. An output of each one of the single-phase UPSs is coupled to one of three single-phase inputs of the adapter, and the adapter is to combine the three single-phase inputs into a single three-phase output.

Abstract: Examples disclosed herein relate to dual in-line memory module (DIMM) battery backup. Some examples disclosed herein describe systems that include a backup power source pluggable into a DIMM slot. The backup power source may include a plurality of battery cells electrically connected to a DIMM to provide backup power to the DIMM. Each of the plurality of battery cells supporting the DIMM may be electrically connected to a DC-to-DC converter in series and to each other in parallel.

Abstract: Examples disclosed herein relate to dual in-line memory module (DIMM) battery backup. Some examples disclosed herein describe systems that include a backup power source pluggable into a DIMM slot. The backup power source may include a plurality of battery cells electrically connected to a DIMM to provide backup power to the DIMM. Each of the plurality of battery cells supporting the DIMM may be electrically connected to a DC-to-DC converter in series and to each other in parallel.

Abstract: An organic-inorganic hybrid structure is described for integrated circuit packages. In one example, an integrated circuit package includes a ceramic frame having a top side and a bottom side, the top side having a pocket with a bottom floor and a plurality of conductive through holes in the bottom floor, an integrated circuit die attached to the bottom floor over the conductive through holes, and a redistribution layer on the bottom side connected to the conductive through holes.

Abstract: An organic-inorganic hybrid structure is described for integrated circuit packages. In one example, an integrated circuit package includes a ceramic frame having a top side and a bottom side, the top side having a pocket with a bottom floor and a plurality of conductive through holes in the bottom floor, an integrated circuit die attached to the bottom floor over the conductive through holes, and a redistribution layer on the bottom side connected to the conductive through holes.