Patents by Inventor Daniel I. Rodriguez

Daniel I. Rodriguez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making a printed circuit board copper plane repair
    Patent number: 9980382
    Abstract: A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of stack conductive layers in addition to a plurality of insulating layers that separate each of the plurality of stack conductive layers. The stack conductive layers may be separated in a manner that aligns them with corresponding printed circuit board conductive layers when the stack portion of the device is inserted into an aperture in a printed circuit board.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: May 22, 2018
    Assignee: International Business Machines Corporation
    Inventors: Mahesh Bohra, Sungjun Chun, Jesus Montanez, Daniel I. Rodriguez
  • Printed circuit board copper plane repair
    Patent number: 9485866
    Abstract: A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of stack conductive layers in addition to a plurality of insulating layers that separate each of the plurality of stack conductive layers. The stack conductive layers may be separated in a manner that aligns them with corresponding printed circuit board conductive layers when the stack portion of the device is inserted into an aperture in a printed circuit board.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: November 1, 2016
    Assignee: International Business Machines Corporation
    Inventors: Mahesh Bohra, Sungjun Chun, Jesus Montanez, Daniel I. Rodriguez
  • Printed circuit board copper plane repair
    Patent number: 9374910
    Abstract: A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of stack conductive layers in addition to a plurality of insulating layers that separate each of the plurality of stack conductive layers. The stack conductive layers may be separated in a manner that aligns them with corresponding printed circuit board conductive layers when the stack portion of the device is inserted into an aperture in a printed circuit board.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: June 21, 2016
    Assignee: International Business Machines Corporation
    Inventors: Mahesh Bohra, Sungjun Chun, Jesus Montanez, Daniel I. Rodriguez
  • PRINTED CIRCUIT BOARD COPPER PLANE REPAIR
    Publication number: 20160150647
    Abstract: A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of stack conductive layers in addition to a plurality of insulating layers that separate each of the plurality of stack conductive layers. The stack conductive layers may be separated in a manner that aligns them with corresponding printed circuit board conductive layers when the stack portion of the device is inserted into an aperture in a printed circuit board.
    Type: Application
    Filed: January 29, 2016
    Publication date: May 26, 2016
    Inventors: Mahesh Bohra, Sungjun Chun, Jesus Montanez, Daniel I. Rodriguez
  • PRINTED CIRCUIT BOARD COPPER PLANE REPAIR
    Publication number: 20150282331
    Abstract: A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of stack conductive layers in addition to a plurality of insulating layers that separate each of the plurality of stack conductive layers. The stack conductive layers may be separated in a manner that aligns them with corresponding printed circuit board conductive layers when the stack portion of the device is inserted into an aperture in a printed circuit board.
    Type: Application
    Filed: June 8, 2015
    Publication date: October 1, 2015
    Inventors: Mahesh Bohra, Sungjun Chun, Jesus Montanez, Daniel I. Rodriguez
  • PRINTED CIRCUIT BOARD COPPER PLANE REPAIR
    Publication number: 20150189754
    Abstract: A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of stack conductive layers in addition to a plurality of insulating layers that separate each of the plurality of stack conductive layers. The stack conductive layers may be separated in a manner that aligns them with corresponding printed circuit board conductive layers when the stack portion of the device is inserted into an aperture in a printed circuit board.
    Type: Application
    Filed: December 31, 2013
    Publication date: July 2, 2015
    Applicant: International Business Machines Corporation
    Inventors: Mahesh Bohra, Sungjun Chun, Jesus Montanez, Daniel I. Rodriguez