Abstract: An ultrasonic device, the device comprising at least one flexible ultrasonic transducer; and a clamp configured to mount the at least one transducer to a test object. Optionally, the clamp may comprise one or more bands and wherein the one or more bands can optionally be metal or at least part of the one or more bands may be formed of a conformable material such that the one or more bands comprises a conformable band or band portion.

Abstract: In a method of inspecting a conduit fitting installed on a conduit end, the conduit fitting comprising a fitting body defining a central bore receiving the conduit end, a transducer is provided secured to a wall portion of the conduit end. The transducer is operated to apply a plurality of ultrasonic signals against an outer surface of the conduit end wall portion at a plurality of axial locations spaced apart from the central bore by a plurality of different distances, such that the plurality of ultrasonic signals are guided axially along the conduit end into the central bore of the conduit fitting and reflected axially back to the transducer. The reflected plurality of ultrasonic signals are evaluated to identify a condition of at least one of the conduit fitting and the conduit end.

Abstract: There is provided a method for manufacturing, or for use in manufacturing a flexible ultrasonic transducer array and the resultant ultrasonic transducer array. The method includes providing a layer of piezoelectric material onto a foil substrate and using additive techniques to apply a plurality of electrodes to a surface of the piezoelectric material such that the electrodes are arranged in an electrode array and to apply a plurality of electrical conduction tracks and a plurality of electrical connectors to the surface of the piezoelectric material or to a layer of dielectric material provided on the surface of the piezoelectric material, such that respective electrical conduction tracks electrically connect a respective electrode to a respective electrical connector. The additive techniques comprise at least one of: masking, deposition, photo patterning, printing or patterned coating.

Abstract: A method for producing an ultrasonic transducer or ultrasonic transducer array, the method comprising providing or depositing a layer of piezoelectric material on a substrate. The piezoelectric material is a doped, co-deposited or alloyed piezoelectric material. The piezoelectric material comprises: a doped, co-deposited or alloyed metal oxide or metal nitride, the metal oxide or metal nitride being doped, co-deposited or alloyed with vanadium or a compound thereof; or zinc oxide doped, co-deposited or alloyed with a transition metal or a compound thereof. Optionally, the deposition of the layer of piezoelectric material is by sputter coating, e.g. using a sputtering target that comprises a doped or alloyed piezoelectric material. In examples, the layer of piezoelectric material is deposited onto the substrate using high power impulse magnetron sputtering (HIPIMS). Further enhancement may be obtained using substrate biasing (e.g. DC and/or RF) during deposition of the layer of piezoelectric material.

Abstract: An ultrasonic sensor comprising an ultrasonic transducer, the ultrasonic transducer comprising: a piezoelectric element; and an active electrode and a counter electrode adapted for electrical connection to the piezoelectric element; wherein the piezoelectric element, the active electrode and the counter electrode are comprised in at least part of an electrical circuit for operating the piezoelectric element; the ultrasonic sensor is mounted or configured to be mountable to an entity to be sensed; and the ultrasonic sensor is adapted such that removal of the ultrasonic sensor from the entity causes a breaking of an electrical circuit so as to render the ultrasonic sensor inoperable or irreversibly inoperable.

Abstract: An ultrasonic device, the device comprising at least one flexible ultrasonic transducer; and a clamp configured to mount the at least one transducer to a test object. Optionally, the clamp may comprise one or more bands and wherein the one or more bands can optionally be metal or at least part of the one or more bands may be formed of a conformable material such that the one or more bands comprises a conformable band or band portion.

Abstract: Described herein is a method for manufacturing, or for use in manufacturing a flexible ultrasonic transducer array and the resultant ultrasonic transducer array. The method includes providing a layer of piezoelectric material onto a foil substrate and using additive techniques to apply at least one electrode to a surface of the piezoelectric material such that the electrodes are arranged in an electrode array. The method also includes using the additive techniques to applying a plurality of electrical conduction tracks and a plurality of electrical connectors to the surface of the piezoelectric material or to a layer of dielectric material provided on the surface of the piezoelectric material, such that respective electrical conduction tracks electrically connect a respective electrode to a respective electrical connector. The additive techniques comprise at least one of: masking, deposition, photo patterning, printing or patterned coating.

Abstract: A method for producing an ultrasonic transducer or ultrasonic transducer array, the method comprising providing or depositing a layer of piezoelectric material on a substrate. The piezoelectric material is a doped, co-deposited or alloyed piezoelectric material. The piezoelectric material comprises: a doped, co-deposited or alloyed metal oxide or metal nitride, the metal oxide or metal nitride being doped, co-deposited or alloyed with vanadium or a compound thereof; or zinc oxide doped, co-deposited or alloyed with a transition metal or a compound thereof. Optionally, the deposition of the layer of piezoelectric material is by sputter coating, e.g. using a sputtering target that comprises a doped or alloyed piezoelectric material. In examples, the layer of piezoelectric material is deposited onto the substrate using high power impulse magnetron sputtering (HIPIMS). Further enhancement may be obtained using substrate biasing (e.g. DC and/or RF) during deposition of the layer of piezoelectric material.