Patents by Inventor Daniel Ivanov Kavaldjiev
Daniel Ivanov Kavaldjiev has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10739276Abstract: Stray and air scattered light can be reduced by configuring a size of the collection area of a sensor, which reduces a source of sensitivity-limiting noise in the system. By adjusting a size of the collection area, stray deep ultraviolet light and air-scattered deep ultraviolet light can be reduced. A servo can control a position of an illumination spot that is collected by the time delay and integration sensor.Type: GrantFiled: December 1, 2017Date of Patent: August 11, 2020Assignee: KLA-Tencor CorporationInventors: Donald Pettibone, Daniel Ivanov Kavaldjiev, Chuanyong Huang, Qing Li, Frank Li, Zhiwei Xu
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Publication number: 20190137411Abstract: Stray and air scattered light can be reduced by configuring a size of the collection area of a sensor, which reduces a source of sensitivity-limiting noise in the system. By adjusting a size of the collection area, stray deep ultraviolet light and air-scattered deep ultraviolet light can be reduced. A servo can control a position of an illumination spot that is collected by the time delay and integration sensor.Type: ApplicationFiled: December 1, 2017Publication date: May 9, 2019Inventors: Donald Pettibone, Daniel Ivanov Kavaldjiev, Chuanyong Huang, Qing Li, Frank Li, Zhiwei Xu
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Patent number: 9273952Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a diffraction grating that widens and passes nth order (n>0) wave fronts to the specimen surface and a reflective surface for each channel of the light beam. Two channels and two reflective surfaces are preferably employed, and the wavefronts are combined using a second diffraction grating and passed to a camera system having a desired aspect ratio. The system preferably comprises a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching scans together, providing for smaller and less expensive optical elements.Type: GrantFiled: July 22, 2014Date of Patent: March 1, 2016Assignee: KLA-Tencor CorporationInventors: Dieter Mueller, Rainer Schierle, Daniel Ivanov Kavaldjiev
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Patent number: 9086389Abstract: Methods and systems for enhancing the dynamic range of a high sensitivity inspection system are presented. The dynamic range of a high sensitivity inspection system is increased by directing a portion of the light collected from each pixel of the wafer inspection area toward an array of avalanche photodiodes (APDs) operating in Geiger mode and directing another portion of the light collected from each pixel of the wafer inspection area toward another array of photodetectors having a larger range. The array of APDs operating in Geiger mode is useful for inspection of surfaces that generate extremely low photon counts, while other photodetectors are useful for inspection of larger defects that generate larger numbers of scattered photons. In some embodiments, the detected optical field is split between two different detectors. In some other embodiments, a single detector includes both APDs operating in Geiger mode and other photodetectors having a larger range.Type: GrantFiled: October 24, 2013Date of Patent: July 21, 2015Assignee: KLA-Tencor CorporationInventors: Daniel Ivanov Kavaldjiev, Stephen Biellak, Guoheng Zhao, Mehdi Vaez-Iravani
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Publication number: 20140333937Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a diffraction grating that widens and passes nth order (n>0) wave fronts to the specimen surface and a reflective surface for each channel of the light beam. Two channels and two reflective surfaces are preferably employed, and the wavefronts are combined using a second diffraction grating and passed to a camera system having a desired aspect ratio. The system preferably comprises a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching scans together, providing for smaller and less expensive optical elements.Type: ApplicationFiled: July 22, 2014Publication date: November 13, 2014Inventors: Dieter Mueller, Rainer Schierle, Daniel Ivanov Kavaldjiev
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Publication number: 20140118730Abstract: Methods and systems for enhancing the dynamic range of a high sensitivity inspection system are presented. The dynamic range of a high sensitivity inspection system is increased by directing a portion of the light collected from each pixel of the wafer inspection area toward an array of avalanche photodiodes (APDs) operating in Geiger mode and directing another portion of the light collected from each pixel of the wafer inspection area toward another array of photodetectors having a larger range. The array of APDs operating in Geiger mode is useful for inspection of surfaces that generate extremely low photon counts, while other photodetectors are useful for inspection of larger defects that generate larger numbers of scattered photons. In some embodiments, the detected optical field is split between two different detectors. In some other embodiments, a single detector includes both APDs operating in Geiger mode and other photodetectors having a larger range.Type: ApplicationFiled: October 24, 2013Publication date: May 1, 2014Applicant: KLA-Tencor CorporationInventors: Daniel Ivanov Kavaldjiev, Stephen Biellak, Guoheng Zhao, Mehdi Vaez-Iravani
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Patent number: 7663746Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.Type: GrantFiled: October 7, 2008Date of Patent: February 16, 2010Assignee: KLA-Tencor Techologies CorporationInventors: Paul J. Sullivan, Geroge Kren, Rodney C. Smedt, Hans J. Hansen, David W. Shortt, Daniel Ivanov Kavaldjiev, Christopher F. Bevis
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Publication number: 20090040514Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.Type: ApplicationFiled: October 7, 2008Publication date: February 12, 2009Applicant: KLA-Tencor Technologies CorporationInventors: Paul J. Sullivan, George Kren, Rodney C. Smedt, Hans J. Hansen, David W. Shortt, Daniel Ivanov Kavaldjiev, Christopher F. Bevis
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Publication number: 20080278732Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a diffraction grating that widens and passes nth order (n>0) wave fronts to the specimen surface and a reflective surface for each channel of the light beam. Two channels and two reflective surfaces are preferably employed, and the wavefronts are combined using a second diffraction grating and passed to a camera system having a desired aspect ratio. The system preferably comprises a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes-means for stitching scans together, providing for smaller and less expensive optical elements.Type: ApplicationFiled: February 5, 2007Publication date: November 13, 2008Applicant: KLA-Tencor CorporationInventors: Dieter Mueller, Rainer Schierle, Daniel Ivanov Kavaldjiev
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Patent number: 7436506Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.Type: GrantFiled: March 1, 2006Date of Patent: October 14, 2008Assignee: KLA-Tencor CorporationInventors: Paul J. Sullivan, George Kren, Rodney C. Smedt, Hans J. Hansen, David W. Shortt, Daniel Ivanov Kavaldjiev, Christopher F. Bevis
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Patent number: 7057741Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a diffraction grating that widens and passes nth order (n>0) wave fronts to the specimen surface and a reflective surface for each channel of the light beam. Two channels and two reflective surfaces are preferably employed, and the wavefronts are combined using a second diffraction grating and passed to a camera system having a desired aspect ratio. The system preferably comprises a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching scans together, providing for smaller and less expensive optical elements.Type: GrantFiled: April 5, 2000Date of Patent: June 6, 2006Assignee: KLA-Tencor CorporationInventors: Dieter Mueller, Daniel Ivanov Kavaldjiev, Rainer Schierle
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Patent number: 7009696Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.Type: GrantFiled: January 16, 2004Date of Patent: March 7, 2006Assignee: KLA-Tencor CorporationInventors: Paul J. Sullivan, George Kren, Rodney C. Smedt, Hans J. Hansen, David W. Shortt, Daniel Ivanov Kavaldjiev, Christopher F. Bevis
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Publication number: 20040145733Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.Type: ApplicationFiled: January 16, 2004Publication date: July 29, 2004Applicant: KLA-Tencor CorporationInventors: Paul J. Sullivan, George Kren, Rodney C. Smedt, Hans J. Hansen, David W. Shortt, Daniel Ivanov Kavaldjiev, Christopher F. Bevis
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Patent number: 6686996Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.Type: GrantFiled: June 7, 2002Date of Patent: February 3, 2004Assignee: KLA-Tencor CorporationInventors: Paul J. Sullivan, George Kren, Rodney C. Smedt, Hans J. Hansen, David W. Shortt, Daniel Ivanov Kavaldjiev, Christopher F. Bevis
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Publication number: 20020154296Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.Type: ApplicationFiled: June 7, 2002Publication date: October 24, 2002Applicant: KLA-Tencor CorporationInventors: Paul J. Sullivan, George Kren, Rodney C. Smedt, Hans J. Hansen, David W. Shortt, Daniel Ivanov Kavaldjiev, Christopher F. Bevis
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Patent number: 6414752Abstract: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.Type: GrantFiled: June 18, 1999Date of Patent: July 2, 2002Assignee: KLA-Tencor Technologies CorporationInventors: Paul J. Sullivan, George Kren, Rodney C. Smedt, Hans J. Hansen, David W. Shortt, Daniel Ivanov Kavaldjiev, Christopher F. Bevis