Patents by Inventor Daniel J. Ayres

Daniel J. Ayres has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10241133
    Abstract: A test probe tip can include a resistive element coupled with a tip component. The resistive element can include a resistive layer disposed on an exterior surface of a structural member of the resistive impedance element. In embodiments, the resistive element can be configured to form a structural component of the test probe tip without an insulating covering applied thereto. Additional embodiments may be described and/or claimed herein.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: March 26, 2019
    Assignee: Tektronix, Inc.
    Inventors: Julie A. Campbell, William A. Hagerup, Ira G. Pollock, Christina D. Enns, James E. Spinar, Kathleen F. M. Ullom, Charles M. Hartmann, Daniel J. Ayres
  • Patent number: 10119992
    Abstract: A test probe tip can include a compliance member or force deflecting assembly and a tip component. The compliance member or force deflecting assembly can include a plunger component and a barrel component to receive the plunger component, wherein the plunger component is configured to slide axially inside the barrel component. The test probe tip can also include a spring mechanism within the barrel component to act on the plunger component, and a resistive/impedance element coupled with the plunger component at one end and with the tip component at the opposite end, the resistive/impedance element including at least one rod having a semi-cylindrical form and a resistive material situated thereon.
    Type: Grant
    Filed: April 1, 2015
    Date of Patent: November 6, 2018
    Assignee: Tektronix, Inc.
    Inventors: William A. Hagerup, Julie A. Campbell, Ira G. Pollock, James E. Spinar, Kathleen F. M. Ullom, Charles M. Hartmann, Daniel J. Ayres, Christina D. Enns
  • Publication number: 20180059139
    Abstract: A test probe tip can include a resistive element coupled with a tip component. The resistive element can include a resistive layer disposed on an exterior surface of a structural member of the resistive impedance element. In embodiments, the resistive element can be configured to form a structural component of the test probe tip without an insulating covering applied thereto. Additional embodiments may be described and/or claimed herein.
    Type: Application
    Filed: November 7, 2017
    Publication date: March 1, 2018
    Applicant: Tektronix, Inc.
    Inventors: Julie A. Campbell, William A. Hagerup, Ira G. Pollock, Christina D. Enns, James E. Spinar, Kathleen F.M. Ullom, Charles M. Hartmann, Daniel J. Ayres
  • Publication number: 20160291054
    Abstract: A test probe tip can include a compliance member or force deflecting assembly and a tip component. The compliance member or force deflecting assembly can include a plunger component and a barrel component to receive the plunger component, wherein the plunger component is configured to slide axially inside the barrel component. The test probe tip can also include a spring mechanism within the barrel component to act on the plunger component, and a resistive/impedance element coupled with the plunger component at one end and with the tip component at the opposite end, the resistive/impedance element including at least one rod having a semi-cylindrical form and a resistive material situated thereon.
    Type: Application
    Filed: April 1, 2015
    Publication date: October 6, 2016
    Inventors: William A. Hagerup, Julie A. Campbell, Ira G. Pollock, James E. Spinar, Kathleen F.M. Ullom, Charles M. Hartmann, Daniel J. Ayres, Christina D. Enns
  • Patent number: 7378936
    Abstract: A circuit element has a substrate layer with first and second faces. A conductive first layer overlays the first surface, and a conductive second layer overlays the second surface. The first layer defines a pattern with a trimmable portion. The second layer defines a pattern having a first conductive element registered with at least a portion of the trimmable portion, and a second conductive element electrically isolated from first element and encompassing the first element. The second element may be a ground plane that has an aperture surrounding the first component, which serves as a shield to prevent damage to any elements beyond the second layer.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: May 27, 2008
    Assignee: Tektronix, Inc.
    Inventors: Devin Bingham, Daniel J. Ayres, Alvin Chow
  • Patent number: 6402565
    Abstract: An electronic interconnect assembly has a high speed coaxial interconnect for a coaxial transmission line having a central signal conductor and a surrounding shield conductor. The coaxial interconnect has a male side and a female side, with the female side including a shield sleeve having a chamber that receives a male shield contact on the male side. The shield sleeve has a contact with a compliant portion that flexibly grips the male shield contact. A mechanical alignment facility includes a closely mating pocket and body, each attached to a respective male or female side of the interconnect. Additional data and power connectors may be included with the pocket and body.
    Type: Grant
    Filed: November 17, 2000
    Date of Patent: June 11, 2002
    Assignee: Tektronix, Inc.
    Inventors: William R. Pooley, Daniel J. Ayres, M. David Swafford, William Q. Law, Michael L. Kyle, J. Steven Lyford, Jonathan E. Myers, Mark W. Nightingale, Jerry R. Shane
  • Patent number: 6402549
    Abstract: An adapter for an electronic interconnect assembly has a high speed coaxial interconnect for a coaxial transmission line having a central signal conductor and a surrounding shield conductor. The coaxial interconnect has a male side and a female side, with the female side including a shield sleeve having a chamber that receives a male shield contact on the male side. The shield sleeve has a contact with a compliant portion that flexibly grips the male shield contact. A mechanical alignment facility portion selected from a pair of alignment facility portions including a closely mating pocket and body has one of the male side or female side of the coaxial interconnect. An electrical signal connector is electrically coupled to the selected male or female of the coaxial interconnect.
    Type: Grant
    Filed: November 17, 2000
    Date of Patent: June 11, 2002
    Assignee: Tektronix, Inc.
    Inventors: Daniel J. Ayres, William Q. Law, M. David Swafford, William R. Pooley
  • Patent number: 6379183
    Abstract: An adapter for an electronic interconnect assembly has a high speed coaxial interconnect for a coaxial transmission line having a central signal conductor and a surrounding shield conductor. The coaxial interconnect has a male side and a female side, with the female side including a shield sleeve having a chamber that receives a male shield contact on the male side. The shield sleeve has a contact with a compliant portion that flexibly grips the male shield contact. A mechanical alignment facility portion selected from a pair of alignment facility portions including a closely mating pocket and body that has one of the male side or female side of the coaxial interconnect. An electrical signal connector is electrically coupled to the selected male or female of the coaxial interconnect.
    Type: Grant
    Filed: November 21, 2000
    Date of Patent: April 30, 2002
    Assignee: Tektronix, Inc.
    Inventors: Daniel J. Ayres, William Q. Law