Abstract: A photonic integrated circuit may include a laser with a first optical frequency related to an atomic transition, the at least one laser pre-stabilized to a frequency reference, where the at least one laser is locked to the frequency reference; a first output coupling grating which outputs light from the laser to a target; a first stress optic modulator adjacent to the first output coupler grating. The first stress optic modulator is configured to modulate the angle of light outputted from the first output coupling grating when a voltage is applied to the first stress optic modulator.

Abstract: A device may include a first waveguide with an optical input at a first port. A device may include a second waveguide. A device may include a first coupler that optically couples the first waveguide to the second waveguide at a first position. A device may include a waveguide delay arm. A device may include a second coupler that optically couples the first waveguide to the second waveguide at a second position, the second position different from the first position.

Abstract: Systems and methods for fast switchable optical filters with high extinction ratio are described. The fast switchable and high extinction ratio optical filters can be based on coupled ultra-high quality factor resonators that are actuated using stress-optical actuators.

Abstract: Systems and methods for photonic integrated laser stabilization that implements one stress-optic modulators in a Pound-Drever-Hall configuration without the complexity or power consumption and loss tradeoffs of conventional bulky acousto-optic modulator (AOM) frequency shifters and electro-optic modulator (EOM) phase modulators are described.

Abstract: Disclosed herein is a stress optical modulator. The modulator include a circular piezo-electric actuator; and a ring waveguide separated from the circular piezo-electric actuator by a top cladding layer. The circular piezo-electric actuator may be offset from the ring waveguide such that a first circular portion of the circular piezo-electric actuator is located on the outside of the ring waveguide and a second circular portion of the circular piezo-electric actuator is located on the inside of the ring waveguide. The circular piezo-electric actuator may be configured to change the guiding properties of the ring waveguide based on the voltage applied to the circular piezo-electric actuator by inducing strain through the top cladding layer to change the optical properties of the ring waveguide.

Abstract: Systems and methods for hybrid integration of ultra-low loss waveguide photonic circuits with various efficient on-chip elements are described. The photonic circuits can integrate various elements including (but not limited to): gain, modulation, detection, and nonlinear optical elements. The integrated photonic chips can be manufactured in a flexible, reconfigurable, 3D heterogeneous platform. The integrated photonic chips can cover wavelength ranges from the visible wavelength to infrared wavelength.

Abstract: A device may at least one laser with a first optical frequency the at least one laser stabilized to a at least one frequency reference, wherein the at least one laser is locked to the at least one frequency reference. A device may at least one photodiode and at least one laser current servo for locking the at least one laser to the at least one frequency reference. A device may at least one modulator configured to modulate a resonator, wherein the at least one frequency reference is a resonator, the resonator comprising a waveguide core and a tuner, wherein the tuner is laterally offset from the waveguide core.

Abstract: Disclosed herein is methods for fabricating ultra-low loss waveguides. One particular method may include: preparing a substrate including a lower cladding layer in a deposition chamber; flowing precursors including deuterated silane and nitrogen onto the lower cladding layer in the deposition chamber; subjecting the precursors to an inductively coupled plasma-plasma enhanced chemical vapor deposition (ICP-PECVD) process which disassociates the deuterated silane and nitrogen and deposits waveguide material of silicon nitride or silicon oxynitride onto the lower cladding layer; patterning the waveguide material into a patterned waveguide material; and depositing a top cladding layer on the patterned waveguide material, wherein the ICP-PECVD process occurs at a temperature less than or equal to 250° C. Advantageously, the ICP-PECVD process allows for deposition of low hydrogenated deposition of material layers which may allow for low temperature fabrication of ultra-low loss waveguides.

Abstract: A device may include an atomic cell with a first wall. A device may include a photonic integrated circuit positioned parallel to the atomic cell first wall, the photonic integrated circuit comprising: a set of three grating emitters mounted on the photonic integrated circuit around a circumference with a spacing of around 120 degrees, wherein each grating emitter is etched to emit free-space beams on to the first wall of the atomic cell at a selected angle, wherein the selected angle in combination with the circumference results in the set of free-space beams intersecting at a location inside the atomic cell.

Abstract: Optical photonic integrated optical clocks on photonic integrated circuits are described. The optical clocks can provide the timing stability of atomic clocks at ultra-low size and power. The optical clocks are be fabricated using CMOS foundry fabrication processes.

Abstract: A Photonic molecule may include a first ring resonator that is tunable by a first piezoelectric actuator. A Photonic molecule may include a second ring resonator that is tunable by a second piezoelectric actuator, wherein the second ring resonator optically coupled to the first ring resonator. A Photonic molecule may include a third ring resonator that is tunable by a third piezoelectric actuator, wherein the third ring resonator is optically coupled to the first ring resonator and the second ring resonator. A Photonic molecule may include a waveguide optically coupled to the first ring resonator.

Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.

Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.

Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.

Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.

Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.