Abstract: A Photonic molecule may include a first ring resonator that is tunable by a first piezoelectric actuator. A Photonic molecule may include a second ring resonator that is tunable by a second piezoelectric actuator, wherein the second ring resonator optically coupled to the first ring resonator. A Photonic molecule may include a third ring resonator that is tunable by a third piezoelectric actuator, wherein the third ring resonator is optically coupled to the first ring resonator and the second ring resonator. A Photonic molecule may include a waveguide optically coupled to the first ring resonator.

Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.

Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.

Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.

Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.

Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

Abstract: An apparatus for controlling, monitoring, and communicating with an optical device, photonic integrated circuit or subassembly is provided. The apparatus includes an optical device or subassembly; and afield programmable device including programmable hardware gates coupled to the optical device or subassembly. The field programmable device may be configured to implement a plurality of functions at a gate level for controlling, monitoring, and/or communicating with the optical device or subassembly, each of the plurality of functions being configured to execute as a concurrent process, without use of a microprocessor or a microcontroller. Further, a programmable optical device, such as a programmable optical transmitter, optical subassembly, or transceiver based on a tunable laser having field programmable device centric control systems with software-enabled features offer extensive real-time control and monitoring functionality based on for example actual traffic flows.

Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.

Abstract: A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.

Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

Abstract: An apparatus for controlling, monitoring, and communicating with an optical device, photonic integrated circuit or subassembly is provided. The apparatus includes an optical device or subassembly; and afield programmable device including programmable hardware gates coupled to the optical device or subassembly. The field programmable device may be configured to implement a plurality of functions at a gate level for controlling, monitoring, and/or communicating with the optical device or subassembly, each of the plurality of functions being configured to execute as a concurrent process, without use of a microprocessor or a microcontroller. Further, a programmable optical device, such as a programmable optical transmitter, optical subassembly, or transceiver based on a tunable laser having field programmable device centric control systems with software-enabled features offer extensive real-time control and monitoring functionality based on for example actual traffic flows.

Abstract: An optical network interface (ONI) module has two main components: an optoelectronic front-end and a general purpose hardware-programmable optical network interface engine. The ONI engine is hardware programmable, allowing the user to configure the overall ONI module with different optoelectronic front-ends and for use with different host modules. In this way, the ONI module can be configured for different applications and protocols.

Abstract: An optical receiver, transmitter, transceiver or transponder for bursty, framed or continuous data. The optical receiver includes a burst mode clock recovery module that recovers the clock rapidly and with a small number of preamble or overhead bits at the front end of the data. A local clock is used for timing when the recovered clock is not available. Transitions between the recovered clock and local clock are smoothed out to avoid undesirable artifacts.

Abstract: An optical network interface (ONI) module has two main components: an optoelectronic front-end and a general purpose hardware-programmable optical network interface engine. The ONI engine is hardware programmable, allowing the user to configure the overall ONI module with different optoelectronic front-ends and for use with different host modules. In this way, the ONI module can be configured for different applications and protocols.

Abstract: An optical receiver, transmitter, transceiver or transponder for bursty, framed or continuous data. The optical receiver includes a burst mode clock recovery module that recovers the clock rapidly and with a small number of preamble or overhead bits at the front end of the data. A local clock is used for timing when the recovered clock is not available. Transitions between the recovered clock and local clock are smoothed out to avoid undesirable artifacts.

Abstract: A semiconductor tunable laser (10) and an interferometer (12) coupled to the tunable laser (10) are monolithically fabricated in a semiconductor heterostructure. The laser also comprises a buried ridge stripe waveguide laser. The interferometer (12) has a semiconductor optical amplifier (38) coupled in each arm. A cross-gain semiconductor optical amplifier converter is coupled to the interferometer (12). The semiconductor optical amplifier (38) coupled in each arm is biased so that an optical path length difference between the two arms is in antiphase which results in destructive interference. The output of the tunable laser (10) is coupled to a coupler. A semiconductor optical amplifier (38) is used as a gain controller for the semiconductor optical amplifiers in the interferometer (12) to allow wavelength conversion over a larger range of input signal powers.