Abstract: A surface mount component adapter, assembly and related method for attaching a surface mount component to a printed circuit board. The surface mount component adapter includes a substrate, a surface mount component holder on the substrate, and flexible leads each having a base end attached to the surface mount component holder and a free end configured to engage a plated through hole on a circuit board. The surface mount component holder is configured to engage electrical contacts of a surface mount component. The surface mount component assembly combines the surface mount adapter with the surface mount component. In the surface mount component method, the surface mount assembly is formed and the free ends of the flexible leads are attached to a corresponding number of the plated through holes on the circuit board.

Abstract: An apparatus may include a housing forming an enclosure having an edge seatable on a printed circuit board (PCB). The enclosure edge may include an edge portion. The housing may be configured to transfer a force applied to the housing to a surface mount component mounted on the PCB to dismount the surface mount component. The apparatus may include a dye inlet formed by the housing and configured to conduct a dye into the enclosure. Another apparatus may include at least one gasket mounted to the enclosure edge to contact the major surface of the PCB adjacent to the surface mount component for forming a seal with the PCB. A method may include enclosing a surface mount component in an enclosure formed in a nozzle apparatus, introducing a dye into the enclosure, and applying a force to the nozzle apparatus to dismount the surface mount component.

Abstract: A surface mount component adapter, assembly and related method for attaching a surface mount component to a printed circuit board. The surface mount component adapter includes a substrate, a surface mount component holder on the substrate, and flexible leads each having a base end attached to the surface mount component holder and a free end configured to engage a plated through hole on a circuit board. The surface mount component holder is configured to engage electrical contacts of a surface mount component. The surface mount component assembly combines the surface mount adapter with the surface mount component. In the surface mount component method, the surface mount assembly is formed and the free ends of the flexible leads are attached to a corresponding number of the plated through holes on the circuit board.

Abstract: An apparatus may include a housing forming an enclosure having an edge seatable on a printed circuit board (PCB). The enclosure edge may include an edge portion. The housing may be configured to transfer a force applied to the housing to a surface mount component mounted on the PCB to dismount the surface mount component. The apparatus may include a dye inlet formed by the housing and configured to conduct a dye into the enclosure. Another apparatus may include at least one gasket mounted to the enclosure edge to contact the major surface of the PCB adjacent to the surface mount component for forming a seal with the PCB. A method may include enclosing a surface mount component in an enclosure formed in a nozzle apparatus, introducing a dye into the enclosure, and applying a force to the nozzle apparatus to dismount the surface mount component.