Abstract: A driver circuit for controlling a high-side power switch of a switching regulator includes: a logic circuit configured to generate a gate control signal for turning on the power switch; a diode having coupled to a first power supply voltage; a capacitor having a first electrode coupled to the cathode of the diode and a second electrode coupled to the switching output voltage; and a delay circuit configured to receive the gate control signal and to generate a delayed gate control signal. In operation, the capacitor is precharged to about the first power supply voltage. When the power switch is turned on, a first output drive transistor is turned on to distribute the charge stored on the capacitor to the gate terminal of the high-side power switch, and after the predetermined delay, a second output drive transistor is turned on to drive the output node to a high supply voltage.

Abstract: A driver circuit for controlling a high-side power switch of a switching regulator includes: a logic circuit configured to generate a gate control signal for turning on the power switch; a diode having coupled to a first power supply voltage; a capacitor having a first electrode coupled to the cathode of the diode and a second electrode coupled to the switching output voltage; and a delay circuit configured to receive the gate control signal and to generate a delayed gate control signal. In operation, the capacitor is precharged to about the first power supply voltage. When the power switch is turned on, a first output drive transistor is turned on to distribute the charge stored on the capacitor to the gate terminal of the high-side power switch, and after the predetermined delay, a second output drive transistor is turned on to drive the output node to a high supply voltage.

Abstract: A sense resistor and integrated circuit package combination is disclosed. A package lead frame is provided having a plurality of landing zones associated therewith and a die mounting area for mounting of a die thereon. The die has a plurality of bond pads associated therewith, with a first bond wire connected between a first one of the landing zones and a second one of the landing zones. The first bond wire forms a sense resistor with a resistance of a known value. A second bond wire is connected between the first one of the landing zones and a first one of the bond pads.

Abstract: A sense resistor and integrated circuit package combination is disclosed. A package lead frame is provided having a plurality of landing zones associated therewith and a die mounting area for mounting of a die thereon. The die has a plurality of bond pads associated therewith, with a first bond wire connected between a first one of the landing zones and a second one of the landing zones. The first bond wire forms a sense resistor with a resistance of a known value. A second bond wire is connected between the first one of the landing zones and a first one of the bond pads.