Patents by Inventor Daniel J. Ferguson

Daniel J. Ferguson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process and apparatus for contamination-free processing of semiconductor parts
    Patent number: 5587095
    Abstract: This invention relates generally to a process and apparatus for contamination-free processing of semiconductor parts. More specifically, this invention relates to a process and apparatus for contamination-free processing of semiconductor parts in an oven or a furnace. This invention also relates to a process and apparatus for contamination-free processing of semiconductor parts in a furnace, such as a belt type furnace that sequentially stops the belt at the vicinity of at least one heating or cooling unit to heat or cool the part.
    Type: Grant
    Filed: August 22, 1995
    Date of Patent: December 24, 1996
    Assignee: International Business Machines Corporation
    Inventors: Nunzio DiPaolo, Daniel J. Ferguson
  • Process and apparatus for contamination-free processing of semiconductor parts
    Patent number: 5550351
    Abstract: An apparatus for contamination-free treating semiconductor parts in a furnace. A carrier into which the semiconductor parts are placed has a cover placed over the carrier to form a boat enveloping the parts while the parts are treated in a furnace. The boat preserves an environment less contaminated than the furnace interior, and may have heating elements embedded in the carrier or cover.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: August 27, 1996
    Assignee: International Business Machines Corporation
    Inventors: Nunzio DiPaolo, Daniel J. Ferguson
  • Process and apparatus for contamination-free processing of semiconductor parts
    Patent number: 5471033
    Abstract: This invention relates generally to a process and apparatus for contamination-free processing of semiconductor parts. More specifically, this invention relates to a process and apparatus for contamination-free processing of semiconductor parts in an oven or a furnace. This invention also relates to a process and apparatus for contamination-free processing of semiconductor parts in a furnace, such as a belt type furnace that sequentially stops the belt at the vicinity of at least one heating or cooling unit to heat or cool the part.
    Type: Grant
    Filed: April 15, 1994
    Date of Patent: November 28, 1995
    Assignee: International Business Machines Corporation
    Inventors: Nunzio DiPaolo, Daniel J. Ferguson
  • Thermoplastic multi-layer packaging film and bags made therefrom having two layers of very low density polyethylene
    Patent number: 5234731
    Abstract: A heat-shrinkable, oriented film having two layers of different very low density polyethylenes is disclosed. The melt index of the polyethylenes differs by about 1 or more decigrams/minute. The films have good shrink and good puncture resistance.
    Type: Grant
    Filed: May 25, 1990
    Date of Patent: August 10, 1993
    Assignee: W.R. Grace & Co.-Conn.
    Inventor: Daniel J. Ferguson
  • Inter-ply adhesion between saran and linear ethylene copolymers
    Patent number: 4778715
    Abstract: Disclosed are multi-layer films having improved adhesion between layers. A film layer comprising vinylidene chloride copolymer is directly adhered to a film layer comprising a blend of ethylene/butyl-acrylate copolymer with linear ethylene/alpha-olefin copolymer.
    Type: Grant
    Filed: June 24, 1987
    Date of Patent: October 18, 1988
    Assignee: W. R. Grace & Co., Cryovac Division
    Inventors: Daniel J. Ferguson, Steven B. Garland
  • Method of making a patch for a shrinkable bag
    Patent number: 4770731
    Abstract: Disclosed is a protective patch for biaxially a heat shrinkable, thermoplastic vacuum bag for protecting the bag from puncture by sharp protruding bones in bone-in cuts of meat which are vacuum packaged within the bags. The patch is made from multi-layer film and preferably comprises outer layers of a blend of linear low density polyethylene and ethylene vinyl acetate copolymer and inner layers of ethylene vinyl acetate copolymer. The patch is heat shrinkable with the bag. A method of making the patch is also disclosed.
    Type: Grant
    Filed: December 4, 1987
    Date of Patent: September 13, 1988
    Assignee: W. R. Grace & Co.-Conn.
    Inventor: Daniel J. Ferguson
  • Protective patch for shrinkable bag
    Patent number: 4765857
    Abstract: Disclosed is a protective patch for biaxially a heat shrinkable, thermoplastic vacuum bag for protecting the bag from puncture by sharp protruding bones in bone-in cuts of meat which are vacuum packaged within the bags. The patch is made from multi-layer film and preferably comprises outer layers of a blend of linear low density polyethylene and ethylene vinyl acetate copolymer and inner layers of ethylene vinyl acetate copolymer. The patch is heat shrinkable with the bag. A method of making the patch is also disclosed.
    Type: Grant
    Filed: April 8, 1987
    Date of Patent: August 23, 1988
    Assignee: W. R. Grace & Co., Cryovac Div.
    Inventor: Daniel J. Ferguson
  • Protective patch for shrinkable bag
    Patent number: 4755403
    Abstract: Disclosed is a protective patch for a biaxially heat shrinkable, thermoplastic vacuum bag for protecting the bag from puncture by sharp protruding bones in bone-in cuts of meat which are vacuum packaged within the bags. The patch is made from multi-layer film and comprises a layer of linear low density polyethylene and a layer of ethylene vinyl acetate copolymer. The patch is biaxially heat shrinkable and shrinks with the bag. A method of making the patch is also disclosed.
    Type: Grant
    Filed: April 10, 1987
    Date of Patent: July 5, 1988
    Assignee: W. R. Grace & Co., Cryovac Div.
    Inventor: Daniel J. Ferguson
  • Multi-layer packaging film and receptacles made therefrom
    Patent number: 4640856
    Abstract: Improved shrink, toughness and barrier properties are achieved by a multi-layer, thermoplastic, shrink film having a substrate layer of very low density polyethylene and a gas barrier layer of vinylidene chloride copolymer or ethylene-vinyl-alcohol. The film is particularly useful for making bags for packaging large cuts of fresh red meat.
    Type: Grant
    Filed: April 29, 1985
    Date of Patent: February 3, 1987
    Assignee: W. R. Grace & Co., Cryovac Div.
    Inventors: Daniel J. Ferguson, Henry G. Schirmer, Walter B. Mueller
  • Heat sealable, multi-ply polypropylene film
    Patent number: 4390385
    Abstract: A heat sealable and shrinkable, coextruded, multi-layer packaging film having a propylene homopolymer base layer and a skin layer of a preferred blend of 60% to 80% propylene-ethylene copolymer with propylene homopolymer provides a sealing temperature range of up to 30.degree. C.
    Type: Grant
    Filed: November 27, 1981
    Date of Patent: June 28, 1983
    Assignee: W. R. Grace & Co., Cryovac Div.
    Inventors: Daniel J. Ferguson, Frederick D. Stringer, Michael D. Esakov