Abstract: Instruments and surgical techniques may be used to correct a bone deformity, such as a bunion in which a metatarsal is misaligned with respect to a medial cuneiform. In some examples, a bone cutting guide is utilized to cut an end of the metatarsal and/or an end of the medial cuneiform to facilitate realignment of the bones. The cutting guide can have a pivotable cut guide surface along which a cutting instrument is translated to provide a precise bone cut. In some applications, after suitably preparing and aligning the bones, the bones are compressed together using a fixation pin. The fixation pin can be driven through one of the bones, into the second bone, and then further driven to compress the bones together.

Abstract: A bone positioning guide may include a main body member, a shaft, and a bone engagement member. The shaft can be movably connected to the main body member and have the bone engagement member rotatably coupled to its distal end. The bone engagement member can have a surface configured to engage a bone. The main body member can also include a tip opposite the bone engagement member for engaging a second bone. In use, the bone engagement member may be positioned in contact with a medial side of a first metatarsal while the tip is positioned in contact with a lateral side of a different metatarsal, such as a second metatarsal. The shaft can then be moved to advance the bone engagement member toward the tip, causing realignment of the first metatarsal.

Abstract: Methods for temporarily fixing an orientation of a bone or bones. Methods of correcting a bunion deformity. Bone positioning devices. Methods of using a bone positioning device. Bone preparation guides. Methods of using a bone preparation guide.

Abstract: This invention relates generally to a process and apparatus for contamination-free processing of semiconductor parts. More specifically, this invention relates to a process and apparatus for contamination-free processing of semiconductor parts in an oven or a furnace. This invention also relates to a process and apparatus for contamination-free processing of semiconductor parts in a furnace, such as a belt type furnace that sequentially stops the belt at the vicinity of at least one heating or cooling unit to heat or cool the part.

Abstract: An apparatus for contamination-free treating semiconductor parts in a furnace. A carrier into which the semiconductor parts are placed has a cover placed over the carrier to form a boat enveloping the parts while the parts are treated in a furnace. The boat preserves an environment less contaminated than the furnace interior, and may have heating elements embedded in the carrier or cover.

Abstract: This invention relates generally to a process and apparatus for contamination-free processing of semiconductor parts. More specifically, this invention relates to a process and apparatus for contamination-free processing of semiconductor parts in an oven or a furnace. This invention also relates to a process and apparatus for contamination-free processing of semiconductor parts in a furnace, such as a belt type furnace that sequentially stops the belt at the vicinity of at least one heating or cooling unit to heat or cool the part.

Abstract: A heat-shrinkable, oriented film having two layers of different very low density polyethylenes is disclosed. The melt index of the polyethylenes differs by about 1 or more decigrams/minute. The films have good shrink and good puncture resistance.

Abstract: Disclosed are multi-layer films having improved adhesion between layers. A film layer comprising vinylidene chloride copolymer is directly adhered to a film layer comprising a blend of ethylene/butyl-acrylate copolymer with linear ethylene/alpha-olefin copolymer.

Abstract: Disclosed is a protective patch for biaxially a heat shrinkable, thermoplastic vacuum bag for protecting the bag from puncture by sharp protruding bones in bone-in cuts of meat which are vacuum packaged within the bags. The patch is made from multi-layer film and preferably comprises outer layers of a blend of linear low density polyethylene and ethylene vinyl acetate copolymer and inner layers of ethylene vinyl acetate copolymer. The patch is heat shrinkable with the bag. A method of making the patch is also disclosed.

Abstract: Disclosed is a protective patch for biaxially a heat shrinkable, thermoplastic vacuum bag for protecting the bag from puncture by sharp protruding bones in bone-in cuts of meat which are vacuum packaged within the bags. The patch is made from multi-layer film and preferably comprises outer layers of a blend of linear low density polyethylene and ethylene vinyl acetate copolymer and inner layers of ethylene vinyl acetate copolymer. The patch is heat shrinkable with the bag. A method of making the patch is also disclosed.

Abstract: Disclosed is a protective patch for a biaxially heat shrinkable, thermoplastic vacuum bag for protecting the bag from puncture by sharp protruding bones in bone-in cuts of meat which are vacuum packaged within the bags. The patch is made from multi-layer film and comprises a layer of linear low density polyethylene and a layer of ethylene vinyl acetate copolymer. The patch is biaxially heat shrinkable and shrinks with the bag. A method of making the patch is also disclosed.

Abstract: Improved shrink, toughness and barrier properties are achieved by a multi-layer, thermoplastic, shrink film having a substrate layer of very low density polyethylene and a gas barrier layer of vinylidene chloride copolymer or ethylene-vinyl-alcohol. The film is particularly useful for making bags for packaging large cuts of fresh red meat.

Abstract: A heat sealable and shrinkable, coextruded, multi-layer packaging film having a propylene homopolymer base layer and a skin layer of a preferred blend of 60% to 80% propylene-ethylene copolymer with propylene homopolymer provides a sealing temperature range of up to 30.degree. C.